锡基端头片式元件导电胶粘接工艺研究  

Electrically Conductive Adhesive for Bonding Sn-based Terminated Chip Components

作　　者：何万波[1] 廖希异 肖玲[1] 胡立雪[1] 罗驰[1] HE Wanbo;LIAO Xiyi;XIAO Ling;HU Lixue;LUO Chi(The 24th Research Institute of China Electronics Technology Group Corporation,Chongqing 400060,P.R.China)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2024年第4期682-686,共5页Microelectronics

摘　　要：在微波集成电路和混合微电路行业,导电胶作为一种替代传统锡铅焊料的组装材料已得到广泛应用,其工艺可靠性成为了国内外微电子封装领域的研究焦点。本文就纯锡和锡铅端头片式元件的粘接工艺进行探索,深入分析和探讨了片式元件端头与导电胶之间脱粘的原因,采用XRF、SEM和EDS等手段对粘接面进行了表征,提出了脱粘机理:在加热过程中,松香与元件端头表面的氧化铅发生化学反应,造成元件端头氧化层“脱皮”,从而导致开裂和脱落。Electrically conductive adhesives(ECAs)are an environmentally friendly alternative to Sn/Pb solders in electronics packaging applications.The main research concerns regarding ECAs are their bonding reliability,which greatly hinders the widespread application.This study explores the process for bonding Sn-and SnPb-terminated chip components through a series of carefully designed experiments.XRF,SEM,and EDS analyses were performed to elucidate the de-bonding mechanism between components metal terminations and the ECAs.The chemical reaction between rosin and oxide layers on the metal termination of the of components are deemed to be responsible for the de-bonding failure.

关 键 词：导电胶粘接可靠性 界面脱粘 端头金属化层 松香 

分 类 号：TN432[电子电信—微电子学与固体电子学]