聚对羟基苯乙烯衍生物及其共聚物的制备与成膜性能  

Preparation and Film-Forming Properties of Poly(p-hydroxystyrene)Derivatives and Their Copolymers

作　　者：廖耘皎 张睿杰 王雨楠 张凯[1] 杨鸣波[1] Yunjiao Liao;Ruijie Zhang;YunanWang;Kai Zhang;Mingbo Yang(College of Polymer Science and Engineering,State Key Laboratory of Polymer Materials Engineering,Sichuan University,Chengdu 610065,China)

机构地区：[1]四川大学高分子科学与工程学院高分子材料工程国家重点实验室,四川成都610065

出　　处：《高分子材料科学与工程》2024年第10期36-45,共10页Polymer Materials Science & Engineering

基　　金：四川省科技厅2022年国际科技创新合作项目(2022YFH0085)。

摘　　要：聚对羟基苯乙烯成膜树脂因其优异的抗刻蚀能力和良好的深紫外透过率被广泛用于光刻技术,然而,其衍生物聚对叔丁氧酰氧基苯乙烯的玻璃化转变温度低,成膜性较差,导致其在光刻胶中的应用受到限制。为解决该问题,文中引入刚性结构3-羟基-1-金刚烷基甲基丙烯酸酯(HADMA)来探究刚性结构及含量对树脂玻璃化转变温度和成膜性的影响。通过傅里叶变换红外光谱、核磁共振氢谱、凝胶渗透色谱证明了共聚物的合成。进一步通过差示扫描量热法、热重分析仪等方法表征了材料的热性能,利用流变仪、台阶仪、扫描电子显微镜、原子力显微镜讨论了刚性结构对材料成膜性能的影响。结果表明,随着HADMA含量的增加,聚合物的玻璃化转变温度从111.7℃提升至132.4℃,聚合物膜开裂和孔洞情况得到显著改善,表面粗糙度保持在2nm内,证明引入刚性结构3-羟基-1-金刚烷基甲基丙烯酸酯能有效提高其玻璃化转变温度和成膜性能。The film-forming resin of poly(p-hydroxystyrene)was widely used in lithography technology due to its superior anti-etching ability and good deep ultraviolet transmittance.However,low glass transition temperature and film-forming properties of its derivative poly(p-tert-butoxyacyloxystyrene)(PHSt)limit its application in photoresist.In order to solve this problem,this work introduced the rigid structure 3-hydroxy-1-adamantane methacrylate(HADMA)into PHSt to explore its influences on the Tg and film-forming properties of the photoresist.The synthesis of the copolymer was proved by FT-IR,1H-NMR and GPC.The thermal properties were further characterized by TGA and DSC.The effects of HADMA on the performance of the materials were discussed by rheometer,step profiler,SEM and AFM.It shows that with the increase of HADMA content,the Tg of the polymer increases from 111.7℃to 132.4℃,the quality of the polymer films is obviously improved,including the number of cracking and hole defects is reduced and the surface roughness is reduced.It is proved that introducing the rigid structure HADMA into PHSt can effectively improve Tg and film-forming properties.

关 键 词：聚对羟基苯乙烯 共聚物 玻璃化转变温度 成膜性 

分 类 号：TN305.7[电子电信—物理电子学]