非等温DSC法研究环氧树脂的固化反应动力学和固化温度  

Study on the Curing Reaction Kinetics and Curing Temperature of Expoxy Resin by Non-isothermal DSC

作　　者：崔丽荣 崔峰波 冉文华 蒋斌兵 朱磊杰 张萍 CUI Lirong;CUI Fengbo;RAN Wenhua;JIANG Binbing;ZHU Leijie;ZHANG Ping(JuShi Group Co.,Ltd.,Tongxiang 314500)

机构地区：[1]巨石集团有限公司,桐乡314500

出　　处：《玻璃纤维》2024年第6期15-19,56,共6页Fiber Glass

摘　　要：根据环氧树脂的固化机理,采用非等温DSC法对环氧树脂/胺体系和环氧树脂/酸酐体系的固化过程进行了研究,并通过Kissinge方程和Crane方程的线性拟合得出固化反应的动力学参数表观活化能E a、指前因子A及反应级数n,最后通过外推的方法推导出了环氧树脂固化反应的固化温度。从机理上解释了环氧树脂2种固化体系的差异,酸酐固化的固化温度比胺固化高,固化速度较胺固化慢,为环氧树脂材料应用固化工艺温度的选取提供了理论上的参考。The curing processes of epoxy resin/amine system and epoxy resin/anhydride system were studied by non-isothermal DSC according to the curing mechanism of epoxy resin.The kinetic parameters of the curing reaction,including the apparent activation energy Ea,the pre-exponential factor A and the reaction order n were obtained through linear fitting of the Kissinge equation and the Crane equation.Finally,the curing temperature of epoxy resin curing reaction was deduced by extrapolation method.The differences between the two curing systems of epoxy resin were explained from the mechanism.The curing temperature of acid anhydride curing is higher than that of amine curing,and the curing speed is slower than that of amine curing,which provide a theoretical reference for the selection of curing process temperature for epoxy resin materials.

关 键 词：DSC 环氧树脂 固化过程 动力学参数 固化温度 

分 类 号：TQ171.777.77[化学工程—玻璃工业]