银包覆法制备Ag-Cu-TiH_(2)焊膏的研究  

Preparation of Ag-Cu-TiH_(2) solder paste by the silver coating method

作　　者：卢永伟 刘满门 张牧 孙旭东[1,4] LU Yongwei;LIU Manmen;ZHANG Mu;SUN Xudong(Key Laboratory for Anisotropy and Texture of Materials(Ministry of Education),School of Material Science and Engineering,Northeastern University,Shenyang 110819,China;Sino-Platinum Metals Semiconductor Materials(Yunnan)Co.Ltd.,Kunming 650503,China;Yunnan Precious Metals Laboratory Co.Ltd.,Kunming 650106,China;Foshan Graduate School of Innovation,Northeastern University,Foshan 528311,Guangdong,China)

机构地区：[1]东北大学材料科学与工程学院材料各向异性与织构教育部重点实验室,沈阳110819 [2]贵研半导体材料(云南)有限公司,昆明650503 [3]云南贵金属实验室有限公司,昆明650106 [4]东北大学佛山研究生创新学院,广东佛山528311

出　　处：《贵金属》2024年第4期9-15,共7页Precious Metals

基　　金：国家自然科学基金联合基金重点支持项目(U1302272);稀贵金属综合利用新技术国家重点实验室开放课题(SKL-SPM-201505)。

摘　　要：Ag-Cu-Ti钎料可以实现Cu和Si_(3)N_(4)陶瓷的连接。然而,钎焊过程中Ti倾向于和Cu反应形成金属间化合物,降低了界面结合强度。本文采用化学还原法,以抗坏血酸为还原剂、Na_(2)EDTA为分散剂,30℃保温30 min,在Cu和Ti H_(2)表面包覆了一层均匀致密的Ag层。由于高活性的Ti降低了熔融Ag的表面张力,使得润湿角降低,焊料的铺展性能更好,此外,包覆Ag后显著抑制了焊膏中Ti和Cu的反应,提高了焊膏的活性,从而提高了覆铜板的界面结合强度。研究发现,包覆银的钎料在陶瓷上的铺展面积提高了8.4%;制备的陶瓷覆铜板剥离强度提高了16.7%。The Ag-Cu-Ti brazing filler metal enables the bonding of copper and Si_(3)N_(4) ceramics.However,during the brazing process,Ti tends to react with Cu to form intermetallic compounds,leading to a reduction in the interfacial bond strength.In this paper,we used a chemical reduction method to coat a uniform and dense layer of Ag on the surfaces of Cu and Ti H_(2) with ascorbic acid as the reducing agent and Na_(2)EDTA as the dispersant,at 30℃for 30 minutes.Due to the high activity of Ti,the surface tension of molten silver is reduced,decreasing the wetting angle between molten silver and Si_(3)N_(4) and improving the spreading performance of the solder.Additionally,the significant suppression of the reaction between Ti and Cu in the solder paste by coating with Ag enhances the solder paste activity,thereby improving the interfacial bond strength of the copper clad laminate.The analysis results revealed the spreading area of silver-coated solder on ceramics increased by 8.4%and the peel strength of the prepared ceramic coated copper plate increased by 16.7%.

关 键 词：AG-CU-TI 包覆银 Si_(3)N_(4)覆铜板 铺展性能 剥离强度 

分 类 号：TG425[金属学及工艺—焊接]