漫话半导体先进封装技术中的新网版印刷(二)  

New Screen Printing in Advanced Packaging Technology for Semiconductors(Part2)

作　　者：熊祥玉 巢亚平 陈港能 李蓉 XIONG Xiangyu;CHAO Yaping;CHEN Gangneng;LI Rong

机构地区：[1]不详

出　　处：《丝网印刷》2024年第21期17-20,共4页Screen Printing

摘　　要：介绍电子封装的定义、封装形式、技术特点和发展优势。芯片的封装技术经历了几代的变迁,最引人注意的基本特点是仍可以利用现有的包括网版印刷技术在内的SMT工艺进行组装或表面贴装。This paper introduces the definition,packaging form,technical characteristics and development advantages of electronic packaging.The chip packaging technology had undergone several generations of changes,the most noticeable basic feature is that the chip can still be assembled or surmounted by the existing SMT process including screen printing technology.

关 键 词：电子封装 芯片 SMT工艺 网版印刷技术 

分 类 号：TN405[电子电信—微电子学与固体电子学]