针对便携设备的高性能扬声器功率放大电路微型化研究  

Research on Miniaturization of High-Performance Speaker Power Amplifier Circuits for Portable Devices

作　　者：葛争光 GE Zhengguang(Jiangsu Donghai Specialized Secondary School,Lianyungang 222300,China)

机构地区：[1]江苏省东海中等专业学校,江苏连云港222300

出　　处：《电声技术》2024年第11期102-104,共3页Audio Engineering

摘　　要：随着便携式电子设备的普及,人们对高性能扬声器功率放大电路的微型化需求日益增长。重点介绍功率放大电路的基本原理和高性能扬声器的工作机制,探讨微型化设计中的技术要求,包括功率密度和热管理、电源管理与效率优化、信号完整性和电磁兼容性、整体尺寸和封装技术。提出微型化技术方案,包括集成电路技术、系统级封装(System In a Package,SIP)技术、散热与热管理技术以及低功耗设计技术,旨在为便携设备提供更高效、更紧凑的音频解决方案。With the popularity of portable electronic devices,people’s demand for miniaturization of high-performance speaker power amplifier circuits is increasing.This paper mainly introduces the basic principle of power amplifier circuit and the working mechanism of high-performance speaker,and discusses the technical requirements in miniaturization design,including power density and thermal management,power management and efficiency optimization,signal integrity and electricityMagnetic compatibility,overall size and packaging technology.The miniaturization technology scheme is proposed,including integrated circuit technology,System In a Package(SIP),heat dissipation and thermal management technology and low power design technology,aiming at providing more efficient and compact audio solutions for portable devices.

关 键 词：便携设备 高性能扬声器 功率放大电路 

分 类 号：TN643[电子电信—电路与系统]