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作 者:王永恒 保爱林 顾在意 WANG Yongheng;BAO Ailin;GU Zaiyi(Shandong Baocheng Electronic Co.,Ltd.,Gaoqing 256300,China)
机构地区:[1]山东宝乘电子有限公司公司,山东高青256300
出 处:《照明工程学报》2024年第6期89-94,共6页China Illuminating Engineering Journal
摘 要:LED电源用的桥式整流器芯片的弧形失效形貌具有一定的典型性,该失效形貌预示着一种失效机制。从整流桥的内互连方法入手,分析了该互连方式必然形成径向电流,该电流在焊接区外缘的分布是不均匀的,由其功耗引起的该区域的PN结温升也是不均匀的,该温升会形成数个峰值点,其中之一会成为芯片在反向工作期间失效的起始点。同时数个结温峰值点之间的弧形高温区域也会演化为弧形失效区域。The arc-shaped failure morphology of bridge rectifier chips used in LED power supplies exhibits a certain typicality,which suggests a specific failure mechanism.Starting from the interconnection method of the rectifier bridge,the analysis shows that this interconnection inevitably creates a radial current.The distribution of this current is non-uniform at the outer edge of the welding zone,resulting in uneven temperature rise at the PN junctions due to the power dissipation in that region.This temperature rise leads to the formation of several peak temperature points,one of which becomes the initiation point for the chip failure during reverse operation.Additionally,the arc high-temperature regions between the junction temperature peaks will evolve into the arc failure area.
分 类 号:TN111[电子电信—物理电子学]
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