钼铜载体与铝合金外壳的无压纳米银胶低温烧结强度  

Sintering Strength of Pressureless Nano-Silver Paste Between Molybdenum-Copper Carrier and Aluminum Alloy Shell at Low Temperature

作　　者：陈澄 尹红波 王成 倪大海 谢璐 曾超林 Chen Cheng;Yin Hongbo;Wang Cheng;Ni Dahai;Xie Lu;Zeng Chaolin(Yangzhou Haike Electronic Technology Co.,Ltd.,Yangzhou 225001,China)

机构地区：[1]扬州海科电子科技有限公司,江苏扬州225001

出　　处：《半导体技术》2025年第1期95-100,共6页Semiconductor Technology

摘　　要：纳米银胶的烧结温度一般为250℃及以上,而在功率模块装配过程中,多温度梯度装配工艺要求纳米银胶的烧结温度不得超过217℃。使用800HT2V纳米银胶烧结钼铜载体与铝合金外壳,观察了不同烧结温度下纳米银胶装配后的微观形貌,测试了其装配后剪切强度、热导率的变化,并进行了温度冲击试验。测试结果表明,烧结样品剪切强度均符合标准要求,随着烧结温度的升高,纳米银胶热导率及剪切强度明显提升,且在最高温度200℃下烧结充分,并形成致密的烧结体。在温度冲击试验后烧结样品的剪切强度均有一定程度的下降,最高温度150℃和175℃烧结的纳米银胶烧结样品剪切强度下降超过40%,而最高温度200℃烧结的样品剪切强度只下降21.2%。考虑到功率模块的长期可靠性,纳米银胶推荐使用最高温度200℃烧结。The sintering temperature of nano-silver paste is generally 250℃or even higher.While in the power module assembly process,the sintering temperature of the nano-silver paste should not exceed 217℃during the multi-temperature gradient assembly process.The 800HT2V nano-silver paste was used to sinter molybdenum-copper carrier and aluminum alloy shell.The micro-morphologies of nano-silver paste assembled at different sintering temperatures were observed.The changes of shear strength and thermal conductivity after assembly were tested,and the temperature shock test was carried out.The test results show that the shear strength of the sintered sample meets the requirements of the standard.With the increase of sintering temperature,the thermal conductivity and shear strength of the nano-silver paste are obviously improved,and the sintering body is fully sintered and formed at the highest temperature of 200℃.The shear strength of the sintered sample decreases to a certain extent after the temperature shock test.The shear strengths of the sintered samples at the highest sintering temperature of 150℃and 175℃decrease by more than 40%,while the strength of the sintered sample at the highest sintering temperature of 200℃only decreases by 21.2%.For long-term reliability of power modules,the nano-silver paste is recommended to be sintered at the highest temperature of 200℃.

关 键 词：无压纳米银胶烧结 钼铜载体 铝合金外壳 剪切强度 热导率 可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]