空心玻璃微珠添加量对有机硅高导热灌封胶性能影响的实验研究  

Experimental study on the effect of hollow glass beads on the properties of silicone potting adhesive with high thermal conductivity

作　　者：丁小卫 欧阳俊花 李艺基 Ding Xiaowei;Ouyang Junhua;Li Yiji(Shenzhen Anpin Silicone Material Co.,Ltd.ShenZhen GuangDong 518100)

机构地区：[1]深圳市安品有机硅材料有限公司,广东深圳518100

出　　处：《塑料包装》2024年第6期30-33,共4页Plastics Packaging

摘　　要：本实验以双组分加成型硅凝胶为主要原料,氧化铝为导热填料,添加空心玻璃微珠、铂金催化剂等制得低介电有机硅高导热灌封胶。研究了添加不同质量百分比的空心玻璃微珠增强导热灌封胶的力学性能、体积电阻率、导热系数、击穿电压和低介电常数。结果表明:随着空心玻璃微珠添加量的逐渐上升,灌封胶的黏度呈现逐渐上升趋势,导热系数、比重、介电常数等逐渐降低;当空心玻璃微珠的添加量达到3.0%时,灌封胶的导热系数降低至0.9W/mK,介电常数达到4.186(1mhz)。In this experiment,two-component additive silicon gel was used as the main raw material,and alumina was used as the thermal conductive filler.Low dielectric and high thermal conductivity silicone potting adhesive was prepared by adding hollow glass beads and platinum catalyst.The mechanical properties,volume resistivity,thermal conductivity,breakdown voltage and low dielectric constant of thermal conductivity potting adhesive reinforced by hollow glass beads with different mass percentage were studied.The results show that the viscosity of potting adhesive increases gradually with the increase of hollow glass beads,and the thermal conductivity,specific gravity and dielectric constant decrease gradually.When the amount of hollow glass beads reached 3.0%,the thermal conductivity of potting glue was reduced to 0.9W/mK,and the dielectric constant was 4.186(1mhz).

关 键 词：导热灌封胶 有机硅 低介电常数 空心玻璃微珠 

分 类 号：TQ436[化学工程] TQ171.79