Modulation of microstructure and properties of Cu−Ni−Sn alloy by addition of trace Ti  

添加微量Ti调控Cu−Ni−Sn合金的显微组织与性能

作　　者：Ying-lin HU Zi-luo CHENG Xiao-na LI Zhu-min LI Yuan-di HOU Min LI Mian YANG Yue-hong ZHENG Chuang DONG 胡莹琳;程子洛;李晓娜;利助民;侯远迪;李敏;杨冕;郑月红;董闯(大连理工大学材料科学与工程学院,大连116024;大连理工大学三束材料改性教育部重点实验室,大连116024;安徽工程大学材料科学与工程学院,芜湖241000;兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,兰州730050)

机构地区：[1]School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,China [2]Key Laboratory of Materials Modification by Laser,Ion and Electron Beams,Ministry of Education,Dalian University of Technology,Dalian 116024,China [3]School of Materials Science and Engineering,Anhui Polytechnic University,Wuhu 241000,China [4]State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals,Lanzhou University of Technology,Lanzhou 730050,China

出　　处：《Transactions of Nonferrous Metals Society of China》2024年第12期3978-3991,共14页中国有色金属学报（英文版）

基　　金：support from the National Natural Science Foundation of China(No.52071052).

摘　　要：The segregation of Sn and discontinuous precipitation at grain boundaries are detrimental to the strength,ductility,and machinability of the Cu−Ni−Sn alloy.A strategy to solve the above problems is multi-component composition design by introducing strong enthalpic interaction element.In this work,a series of Cu_(80)Ni_(15)Sn_(5−x)Ti_(x)(at.%)alloys were designed by cluster-plus-glue-atom model,and the effects of Ti content on the microstructure and properties of the alloys were systematically investigated using TEM and other analysis methods.The results demonstrate that Ti can effectively inhibit the segregation and discontinuous precipitation while promoting continuous precipitation to improve the high-temperature stability of the alloys.As the Ti content increases,the distribution of Ti changes from uniform distribution to predominant precipitation.The hardness and conductivity of the alloy exceed those of the C72900(Cu−15Ni−8Sn(wt.%))commercial alloy and the Cu_(80)Ni_(15)Sn_(5)(at.%)reference alloy when Ti is in the solution state.Sn偏析和晶界处不连续析出会恶化Cu−Ni−Sn合金的强度、塑性和可加工性。为了解决上述问题,可通过引入强焓相互作用元素对合金进行多组元化成分设计。本文采用团簇加连接原子模型设计一系列Cu_(80)Ni_(15)Sn_(5−x)Ti_(x)(摩尔分数,%)合金,然后利用TEM等分析方法系统研究了Ti含量对合金显微组织及性能的影响。结果表明,Ti能有效抑制偏析和不连续析出,同时促进连续析出,从而提高合金的高温稳定性。随着Ti含量的增加,Ti在合金中的分布方式从均匀分布转变为以析出为主。当Ti处于固溶状态时,合金的硬度和电导率均超过C72900(Cu−15Ni−8Sn(质量分数,%))工业合金和Cu_(80)Ni_(15)Sn_(5)(摩尔分数,%)参比合金。

关 键 词：Cu−Ni−Sn alloy microstructure properties cluster-plus-glue-atom model segregation discontinuous precipitation enthalpic interaction 

分 类 号：TG146.11[一般工业技术—材料科学与工程]