Additive manufacturing of pure copper via vat photopolymerization with slurry  

基于浆料的光固化增材制造纯铜

作　　者：An-liang YE Meng WANG Yan-bin JIANG Xiao-zan WU Chao-qun PENG Jin HE Xiao-feng WANG 叶安梁;王檬;姜雁斌;伍晓赞;彭超群;何进;王小锋(中南大学材料科学与工程学院,长沙410083;中国科学院上海光学精密机械研究所高功率激光器材料重点实验室,上海201800;中南大学粉末冶金国家重点实验室,长沙410083)

机构地区：[1]School of Materials Science and Engineering,Central South University,Changsha 410083,China [2]Key Laboratory of Materials for High Power Lasers,Shanghai Institute of Optics and Fine Mechanics,Chinese Academy of Sciences,Shanghai 201800,China [3]State Key Laboratory of Powder Metallurgy,Central South University,Changsha 410083,China

出　　处：《Transactions of Nonferrous Metals Society of China》2024年第12期3992-4004,共13页中国有色金属学报（英文版）

基　　金：supported by the Major Science and Technology Projects in Fujian Province,China(No.2023HZ021005);the State Key Laboratory of Powder Metallurgy,Central South University,China,and Fujian Key Laboratory of Rare-earth Functional Materials,China.

摘　　要：Stereolithography(SLA)combined with a two-step post-processing method“oxidation−reduction”was developed to fabricate pure copper with high complexity.The copper slurries for SLA were prepared,and particularly the influence of volume fraction of copper on the properties of copper slurries was investigated.In the two-step post-treatment process,organics were removed by oxidation and copper powder was oxidized simultaneously,and then the oxidized copper was reduced into highly reactive copper particles,improving the sintering activity of the copper green body and enhancing the relative density of the sintered part.The results show that curing depth of the copper slurries decreased with the increase of volume fraction of copper.The viscosity of the pure copper slurry rises exponentially as the volume fraction of copper exceeded 50%.The highest volume fraction of pure copper slurry for SLA is 55%.The specimens exhibited an increase in hardness and electrical conductivity with the increase of volume fraction of copper.Specifically,the maximum values of hardness and conductivity of samples with 55 vol.%copper were HV 52.7 and 57.1%(IACS),respectively.采用立体光刻(SLA)并结合“氧化−还原”两步后处理法制造复杂形状的纯铜部件。制备了SLA用铜浆,并重点考察了铜体积分数对铜浆性能的影响。在两步后处理过程中,通过氧化将生坯内的有机物排除并同时氧化铜粉,再将氧化铜还原成高活性的铜颗粒,进而增加铜生坯的烧结活性,并提高烧结体的相对密度。结果表明:铜浆的固化深度随铜体积分数的增加而减小。当铜的体积分数超过50%时,纯铜浆的黏度呈指数上升。适用于SLA纯铜浆料的最高体积分数为55%。随着铜体积分数的增加,样品的硬度和电导率增加。当铜体积分数为55%时,样品的硬度和电导率均达到最大值,分别为HV 52.7和57.1%(IACS)。

关 键 词：pure copper additive manufacturing STEREOLITHOGRAPHY complex structure parts copper slurry 

分 类 号：TG146.11[一般工业技术—材料科学与工程]