芯片高分子材料涂覆硬件条件  

Hardware Conditions for Chip Polymer Material Coating

作　　者：孙洪君 关丽 韩洋 姜倍鸿 SUN Hongjun;GUAN Li;HAN Yang;JIANG Beihong

机构地区：[1]沈阳芯源微电子设备股份有限公司,辽宁沈阳110168

出　　处：《今日自动化》2024年第11期61-63,共3页Automation Today

摘　　要：光刻工艺已成为超大规模集成电路的一项重要工艺,而涂胶工艺是光刻工艺中的基础步骤之一,其中高分子材料涂覆结果的优劣,决定了光刻工艺的图形化转移结果的好坏。然而,涂胶显影设备各单元的硬件条件的稳定性和可靠性,很大程度上决定了光刻工艺结果的好坏。因此,为了能实现稳定的光刻工艺技术,涂胶显影设备各单元的硬件必须满足必要的工艺技术条件。文章以光阻在硅晶圆表面涂覆为例,探究了涂胶单元内硬件条件的变化对光阻薄膜厚度的影响,以期为相关人员提供参考。Photolithography has become an important process for ultra large scale integrated circuits,and the coating process is one of the fundamental steps in lithography.The quality of the polymer material coating results determines the quality of the graphic transfer results in lithography.However,the stability and reliability of the hardware conditions of each unit of the coating and developing equipment largely determine the quality of the photolithography process results.Therefore,in order to achieve stable photolithography technology,the hardware of each unit of the coating and developing equipment must meet the necessary process technology conditions.The article takes the coating of photoresist on the surface of silicon wafers as an example to explore the influence of changes in hardware conditions within the coating unit on the thickness of photoresist films,in order to provide reference for relevant personnel.

关 键 词：涂胶显影设备 硬件稳定性 图形化转移 工艺技术 

分 类 号：R318.08[医药卫生—生物医学工程]