金刚石车刀前角与切削刃钝圆半径对单晶硅加工表层质量的影响  

EFFECTS OF DIAMOND CUTTING TOOL'S RAKE ANGLE AND ROUNDED CUTTING EDGE RADIUS ON THE MACHINED SINGLE CRYSTAL SILICON SURFACE QUALITY

作　　者：赵清亮[1] 陈明君[1] 梁迎春[1] 董申[1] 邓驰[1] 

机构地区：[1]哈尔滨工业大学机电工程学院,哈尔滨150001

出　　处：《机械工程学报》2002年第12期54-59,共6页Journal of Mechanical Engineering

基　　金：国家自然科学基金资助项目(59835180)。

摘　　要：在对单晶硅的超精密切削加工中,为了优化金刚石刀具参数以利于实现其塑性域切削,运用线弹性断裂力学和有限元法对在不同的刀具前角和切削刃钝圆半径下切削区域的应力场分布和微裂纹扩展规律进行了计算仿真研究,并在此基础上进行了单晶硅的金刚石切削试验以验证仿真分析。结果表明,采用前角范围为-15°～-25°的车刀进行切削有利于抑制原子级尺寸裂纹初步扩展成微裂纹,因此可以提高加工时的脆塑转变临界切深值,有利于实现塑性域切削;而且,切削刃钝圆半径越小加工时的微裂纹就越不易扩展,因此也就容易实现单晶硅的塑性域车削,得到高质量的金刚石切削加工表面。For the purpose of realizing the brittle material's turning in ductile mode on the basis of optimizing the diamond cutting tool's geometrical parameters, the linear elastic fracture mechanics and finite element method are applied to stimulate the stress distribution and micro-cracks' expanding in the cutting region generated under different rake angles and rounded cutting edge radius. The cutting experiments on single crystal silicon surface are then conducted to verify the stimulation results, which shows that the expanding of micro-cracks can be restrained from atomic-size cracks when utilizing the diamond cutting tools with-15° - -25° rake angles. As a result of increasing the value of the critical depth of cut of brittle-ductile transition, the goal of ductile-mode turning can be achieved. In addition, with a smaller cutting edge radius, the turning of brittle material in ductile-mode can be easily realized, resulting in good diamond turned surface quality.

关 键 词：金刚石车刀前角 切削刃钝圆半径 有限元分析 单晶硅 原子力显微镜 表面质量 

分 类 号：TN304.12[电子电信—物理电子学] TG7[金属学及工艺—刀具与模具]