优化SMC模压工艺控制制品收缩率和表面粗糙度  

Controlling shrinkage ratio and surface-quality through optimization of process conditions in SMC molding

作　　者：谢怀勤[1] 李地红[1] 吴新跃[1] 

机构地区：[1]哈尔滨工业大学材料科学与工程学院,黑龙江哈尔滨150006

出　　处：《哈尔滨建筑大学学报》2002年第6期47-49,共3页Journal of Harbin University of Civil Engineering and Architecture

摘　　要：优化SMC模压工艺参数:模压压力分为二阶段,选定最佳压力释放时机和压力;适宜降低模压温度。可显著降低SMC制品的固化收缩率,提高其表观质量。试验表明,同时采用的线收缩率和表面粗糙度两种检测和标定方法具有很好的同一性。Through the optimization of processing conditions in SMC mold, the optimum pressure release time and the pressure in the second stage are determined , and molding runs are carried out at two-stage pressure, and the mold temperature is reduced as appropriate to reduce curing shrinkage and improve surface-quality in SMC molding.

关 键 词：片状模塑料 模压工艺 模压压力 固化收缩 表面粗糙度 不饱和聚酯树脂 

分 类 号：TU599[建筑科学—建筑技术科学]