AuCl_4^-离子存在下纳米铜胶的制备  

PREPARATION OF NANOSIZED COPPER COLLIDE IN THE PRESENCE OF AuCl^-_4

作　　者：夏纲[1] 徐琴[1] 胡效亚[1] 郭荣[1] 

机构地区：[1]扬州大学理学院化学化工系,江苏扬州225002

出　　处：《扬州大学学报（自然科学版）》2002年第4期27-31,共5页Journal of Yangzhou University：Natural Science Edition

基　　金：国家自然科学基金资助项目 (2 0 175 0 2 3) ;江苏省自然科学基金资助项目 (BK2 0 0 2 0 4 5 )

摘　　要：以十二烷基硫酸钠 (SDS)作保护剂 ,肼作还原剂 ,在硫酸铜溶液中加入相当于铜物质的量含量 1 %的 Au Cl-4离子 ,金先被还原出来作为金核 ,后续还原的铜沿着金表面生长 ,从而制备出直径 5 nm左右较均匀的铜纳米颗粒 ,溶液中过量肼的存在可以使铜胶保持还原态 .另外 ,对铜胶形成过程中粒子的聚集现象进行了探讨 .This paper describes the synthesis of copper colloids which are protected by surfactant. The method is simple, low cost and the particles obtained are stable and uniform. Cu colloids are prepared in the presence of SDS used as protective agent and 1% auric tetrachloride ions. Hydrazine is used as reducing agent. In the process of synthesis, AuCl - 4 is reduced first by hydrazine to form the gold nuclei. Then reduction of copper ions is developed on the surface of gold nuclei, and uniform Cu particles with the diameter of 5 nm formed. Excess hydrazine can keep the copper colloids in reductive state. The agglomeration mechanism of colloids in the synthesis process is also discussed.

关 键 词：AuCl4^-离子 纳米铜胶 制备 纳米颗粒 表面活性剂 肼 纳米材料 纳米胶体 

分 类 号：TB383[一般工业技术—材料科学与工程] O648.1[理学—物理化学]