铝基复合材料与铝合金的TLP扩散连接  

TLP Diffusion Bonding of Aluminum Base Composite and Aluminum Alloy

作　　者：曲文卿[1] 王奇娟 张彦华[1] 

机构地区：[1]北京航空航天大学702教研室,北京100083 [2]北京卫星制造厂,北京100083

出　　处：《焊接学报》2002年第6期67-70,共4页Transactions of The China Welding Institution

摘　　要：采用TLP扩散连接方法对铝合金与SiC颗粒增强Al基复合材料进行了连接试验研究 ,应用扫描电镜和能谱分析技术对TLP连接接头进行了微观组织观察和接头区域各元素的浓度分布测试。结果表明 ,SiC颗粒增强铝基复合材料与铝合金连接接头区域连接界面向铝合金一侧偏移 ,接头区域溶质原子浓度分布非常不均匀 ,由于溶质原子扩散速度以及中间层和母材冶金反应的不同 。The experimental study on TLP diffusion bonding of SiC particle reinforced Al based composite and aluminium alloy is conducted,and the microstructures of TLP diffusion bond is observed using SEM(S530),and the concentration profiles of elements in the joint area are measured using EDS(Link Systems 860 Analyzer).The research indicated that the bonding interface departures to aluminium alloy from the original central line in the joint area of SiC particle reinforced Al based composite and aluminium alloy,and the concentration profile of solute atoms distribute fairly asymmetrically.Because of difference of the solute atoms diffusion speeds and the metallurgical reaction between interlayer and base metal,the dissymmetry exists obviously in TLP diffusion bonding process of aluminum base composite and aluminum alloy.The study provides a scientific basis for the bonding of composite and metal.

关 键 词：铝基复合材料 铝合金 TLP扩散连接 

分 类 号：TG457.14[金属学及工艺—焊接] TG4