加工参数对HTCC生瓷片通孔质量的影响  

Influence of Processing Parameters on the Quality of Through Hole of HTCC Green Tape

作　　者：马栋栋 张鑫磊 程换丽 王杰 刘曼曼 Ma Dongdong;Zhang Xinlei;Cheng Huanli;Wang Jie;Liu Manman(The 13th Research Institute,CETC,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《微纳电子技术》2025年第1期158-164,共7页Micronanoelectronic Technology

摘　　要：激光打孔是高温共烧陶瓷(HTCC)多层基板工艺流程的重要工序。采用皮秒激光对氧化铝生瓷片进行通孔加工实验,研究了不同激光功率、加工速度和重复频率对加工的通孔形貌和尺寸的影响。结果表明:激光功率对生瓷片通孔直径、圆度和锥度影响较大,随着激光功率增加,通孔入口孔直径逐渐增大且入口孔圆度变差;激光功率10 W时通孔锥度最小,为0.008°;随着加工速度(100~500 mm/s)增加,通孔直径减小,加工速度每增加100 mm/s,通孔直径降低约0.005 mm,加工速度对通孔圆度和锥度影响较小;重复频率(600~1 000 kHz)对通孔直径、圆度和锥度影响较小。通过选用适当的激光功率(10~15 W)和加工速度(200~400 mm/s)可得到高品质通孔。Laser drilling is an important step in the high temperature co-fired ceramic(HTCC)multilayer substrate process.The experiment of through hole processing of alumina green tape was carried out by picosecond laser.The effects of different laser power,processing speed and repetition frequency on the morphology and size of the processed through holes were studied.The results show that the laser power has a significant influence on the diameter,roundness and taper of the green tape through hole.With the increase of the laser power,the inlet-hole diameter of the through hole gradually increases and the inlet-hole roundness becomes worse.When the laser power is 10 W,the taper of the through hole is the smallest,which is 0.008°.As the processing speed(100-500 mm/s)increases,the through hole diameter decreases,and the through-holediameter decreases by about 0.005 mm for every 100 mm/s increase in the processing speed. Theprocessing speed has little influence on the roundness and taper of the through hole. Therepetition frequency (600-1 000 kHz) has little influence on the diameter, roundness and taperof the through hole. By selecting appropriate laser power (10-15 W) and processing speeds(200-400 mm/s) , high-quality through holes can be obtained.

关 键 词：氧化铝生瓷片 皮秒激光 激光打孔 激光功率 加工速度 通孔尺寸 

分 类 号：TN305[电子电信—物理电子学]