半导体自动化点胶设备加热结构能耗规律分析  

Analysis of Energy Consumption of Semiconductor Automatic Dispensing Heating Equipment

作　　者：许文强 Xu Wenqiang(Shenzhen to Yulong Automation Equipment Co.,Ltd.,Shenzhen,China)

机构地区：[1]深圳市向宇龙自动化设备有限公司,广东深圳

出　　处：《科学技术创新》2025年第3期209-212,共4页Scientific and Technological Innovation

摘　　要：随着微电子领域热熔胶广泛应用,加热设备能耗和效率成为生产考虑的必要因素,在提升加热效率和节能减排之间合理分配,对我国日益庞大的半导体产业具有重要意义。以半导体点胶生产常用热熔胶为试验对象,分析加热结构在不同加热功率下,胶水达到指定温度所需时间变化规律,得到加热结构随加热功率增加对加热效率的影响关系。研究结果表明,当加热功率达到或趋近某一临界值时,加热结构的能量耗散成为影响升温速度的主导因素,加热效率将不再增加。With the widespread application of hot melt adhesive in the microelectronics field,energy consumption and efficiency of heating equipment have become necessary factors to consider in production.It is of great significance for China's growing semiconductor industry to allocate resources reasonably between improving heating efficiency and achieving energy savings and emission reductions.Using commonly used hot melt adhesive in semiconductor dispensing production as the experimental object,we analyze the changes in the melting rate of glue under different heating powers by examining the heating structure.The results show that when the heating power reaches or approaches a certain critical value,the energy dissipation of the heating structure becomes the dominant factor affecting the heating rate,and the heating efficiency will no longer increase.

关 键 词：热熔胶 设备能耗 加热效率 节能减排 半导体 

分 类 号：TN305.94[电子电信—物理电子学]