一种X波段超薄低剖面射频收发前端设计  

Design of an X-band Ultra-thin Low-profile RF Transceiver Front-end

作　　者：苏祺 任家怡 林宏声 米添 SU Qi;REN Jiayi;LIN Hongsheng;MI Tian(Southwest China Research Institute of Electronic Equipment,Chengdu 610036,China;Sichuan Province Engineering Research Center for Broadband Microwave Circuit High Density Integration,Chengdu 610036,China)

机构地区：[1]中国电子科技集团第二十九研究所,成都610036 [2]四川省宽带微波电路高密度集成工程研究中心,成都610036

出　　处：《微波学报》2024年第S1期407-411,共5页Journal of Microwaves

摘　　要：针对有源相控阵系统对射频前端的高效率、低噪声、低剖面、轻量化需求,本文提出了一种X波段超薄低剖面射频收发前端。该收发前端采用三维堆叠硅基SiP与复合基板集成架构,实现了64通道收发微模组、移相延迟、数控衰减、波控、电源管理等功能模块的高密度、低剖面、一体化集成。通过设计多种高效率、低损耗的垂直互联过渡结构,实现了不同微模块间的去电缆化、高性能低损耗互联。实测结果表明:设计的射频前端剖面高度小于10mm,重量优于2kg,噪声系数优于3dB、发射效率大于22%,通道幅度一致性±0.5dB、相位一致性±5°,同时具备低剖面、轻量化、高效率、一致性好、可扩展性强的优点。To address the high efficiency,low noise,low profile,and lightweight requirements of active phased array systems for RF front ends,this paper proposes an ultra-thin,low-profile RF transceiver front end for the X-band.This transceiver front end adopts a three-dimensional stacked silicon-based SiP and composite substrate integrated architecture,achieving high-density,low-profile,and integrated functionalities of 64-channel transceiver micro-modules,phase shift delay,digital control attenuation,beam control,and power management.By designing various high-efficiency,low-loss vertical interconnect transition structures,the de-cabling and high-performance low-loss interconnection between different micro-modules are realized.The measured results show that the designed RF front end has a profile height of less than 10mm,a weight of less than 2kg,a noise figure better than 3dB,a transmission efficiency greater than 22%,channel amplitude consistency of±0.5dB,and phase consistency of±5°,while also possessing the advantages of low profile,lightweight,high efficiency,good consistency,and strong scalability.

关 键 词：有源相控阵 射频前端 低剖面 T/R组件 硅基SiP 

分 类 号：TN859[电子电信—信息与通信工程]