宽带高性能SiP频率源  

Broadband High-performance System-in-package Frequency Synthesizer

作　　者：毛云山 陈远林 邱一峰 周平 侯照临 LIU linwei MAO Yunshan;LIU linwei;CHEN Yuanlin;QIU Yifeng;HOU Zhaolin(Southwest Electronic Equipment Research Institute,Chengdu 610036,China;Broadband Microwave Circuit High-density Integrated Engineering Research Center ofSichuan Province,Chengdu 610036,China;不详)

机构地区：[1]西南电子设备研究所,成都610036 [2]四川省宽带微波电路高密度集成工程研究中心,成都610036 [3]不详

出　　处：《微波学报》2024年第S1期143-146,共4页Journal of Microwaves

摘　　要：现代电子系统中,宽带、高性能、小型化是频率合成器的关键技术指标。本文采用陶瓷穿孔(TCV)与三维堆叠工艺,提出了基于双锁相环、环内混频、高频率鉴相架构的小型化频率源方案。首次在21 mm×16 mm×3.6 mm的体积下实现了输出频率覆盖Ku波段、系统级封装(SiP)的频率合成器,该合成器在20GHz的相位噪声优于-100dBc/Hz@1kHz,杂散抑制优于60dBc。In modern electronic systems,broadband,high performance and miniaturization are the key technical indexes of frequency synthesizer.In this paper,a miniaturized frequency source scheme with double phase-locked loop,in-loop mixing and high frequency phase discriminating architecture is proposed by using Through Ceramic Via(TCV)and three-dimensional stacking technology.For the first time,a System in Package(SiP)frequency synthesizer with output frequency covering Ku-band was implemented in a volume of21 mmÍ16 mmÍ3.6 mm.The synthesizer's phase noise at 20GHz is less than-100dBc/Hz@1kHz,and spurious suppression is better than 60dBc.

关 键 词：系统级封装(SiP) 频率合成器 陶瓷穿孔工艺(TCV) 三维堆叠 混频锁相 高频率鉴相 

分 类 号：TN74[电子电信—电路与系统]