In-situ Si particle-reinforced joints of hypereutectic Al−60Si alloys by ultrasonic-assisted soldering  

超声辅助钎焊制备原位硅颗粒增强过共晶Al−60Si合金接头

作　　者：Yuan-xing LI Xiang-bo ZHENG Chao-zheng ZHAO Zong-tao ZHU Yu-jie BAI Hui CHEN 李远星;郑向博;赵朝政;朱宗涛;白玉杰;陈辉(西南交通大学材料科学与工程学院教育部材料先进技术重点实验室,成都610031)

机构地区：[1]Key Laboratory of Advanced Technologies of Materials,Ministry of Education,School of Materials Science and Engineering,Southwest Jiaotong University,Chengdu 610031,China

出　　处：《Transactions of Nonferrous Metals Society of China》2025年第1期77-90,共14页中国有色金属学报(英文版)

基　　金：financial support from the National Natural Science Foundation of China(Nos.52275385,U2167216);Sichuan Province Science and Technology Support Program,China(No.2022YFG0086).

摘　　要：To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.为了改善过共晶Al−60Si合金的润湿性,提高接头的力学性能,采用Sn−9Zn焊料超声焊接Al−60Si合金,得到了原位Si颗粒增强的良好接头。采用透射电镜(TEM)对Al−60Si合金界面处的氧化膜进行分析,鉴定其物相为非晶Al_(2)O_(3)。并且,母材中Si颗粒的氧化膜经鉴定也是Al_(2)O_(3)。经过试验发现氧化膜的去除主要是依靠超声振动,而非保温处理。通过延长超声时间,可获得硅颗粒增强接头(35.7%,体积分数)。当焊接温度为330℃、超声振动时间为50 s时,焊缝抗剪强度最大,达到99.5 MPa。提出了超声作用下Si颗粒增强接头的形成机理模型,认为超声振动起到了促进Al溶解和Si颗粒迁移的作用。

关 键 词：hypereutectic Al−60Si alloy ultrasonic-assisted soldering Si particle reinforcement Sn−9Zn solder 

分 类 号：TG454[金属学及工艺—焊接]