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作 者:刘俊林 张志成[1] 崔展鹏 陈鹏[2] 石新未 LIU Junlin;ZHANG Zhicheng;CUI Zhanpeng;CHEN Peng;SHI Xinwei(Beijing Special Engineering Design and Research Institute,Beijing 100028,China;Ministerial Key Laboratory of Intelligent Ammunition Technology,Nanjing University of Science and Technology,Nanjing 210094,China)
机构地区:[1]北京特种工程设计研究院,北京100028 [2]南京理工大学智能弹药技术国防重点学科试验室,江苏南京210094
出 处:《防护工程》2024年第1期31-35,共5页Protective Engineering
摘 要:为研究电子设备在爆炸冲击载荷作用下的毁伤效应,通过设计等效电子目标,采用数值模拟的方式分析了在600 g TNT当量冲击载荷下等效电子目标的结构响应情况。结果表明,在爆炸冲击载荷作用下,铝壳最大变形位移量与超压峰值呈类线性关系变化;随着爆炸距离的增大,等效电路板的振动加速度峰值逐渐减小,而加速度振动周期逐渐增长;当超压峰值小于0.641 MPa时,等效电子目标的破坏主要来自内部电子元器件的爆炸冲击振动效应。To investigate the damage effects on electronic devices under explosive impact loads,an equivalent electronic target was designed,and numerical simulations were conducted to analyze the structural response under a 600 g TNT equivalent explosive load.The results indicate that,under the explosive impact load,the maximum deformation displacement of the aluminum shell shows a linear relationship with the overpressure peak value.As the explosion distance increases,the peak vibration acceleration of the equivalent circuit board gradually decreases,while the acceleration vibration period gradually increases.When the overpressure peak value is less than 0.641 MPa,the primary damage to the equivalent electronic target comes from the explosive impact vibration effect on the internal electronic components.
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