新型网络芯片技术  

New Network Chip Technology

作　　者：成伟 王俊杰 杨勇涛 CHENG Wei;WANG Junjie;YANG Yongtao(Suzhou Centec Communications Co.,Ltd.Suzhou 215125,China)

机构地区：[1]苏州盛科通信股份有限公司,中国苏州215125

出　　处：《中兴通讯技术》2024年第6期68-73,共6页ZTE Technology Journal

摘　　要：针对大规模AI模型训练的高强度通信需求,从高性能交换架构、高性能端口、低时延、无损流控和多维负载均衡等关键技术维度,提出新型网络芯片的整体解决方案。通过整合先进网络架构与多种优化手段,该方案能够有效降低通信开销,提升训练效率,推动AI和高性能计算的规模化应用落地。Aiming at the high-intensity communication requirements for large-scale AI model training,an overall solution of new network chip is proposed from the key technical dimensions of high-performance switching architecture,high-performance ports,low-latency,loss-less flow control,and multi-dimensional load balancing.By integrating advanced network architecture and various optimization means,this solution can effectively reduce communication overhead,improve training efficiency,and promote the large-scale application of AI and high-performance computing.

关 键 词：网络芯片 高性能交换架构 高性能端口 低时延 无损流控 负载均衡 

分 类 号：TP3[自动化与计算机技术—计算机科学与技术]