Multilayer laminated Cu coil/CaO-Li_(2)O-B_(2)O_(3)-SiO_(2)glass-ceramic preparation via a novel insulation packaging strategy for flat wire motor applications  

作　　者：Haitao Zhu Yanyu Song Guangyou Pan Naibin Chen Xiaoguo Song Long Xia Duo Liu Shengpeng Hu 

机构地区：[1]State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin,150001,China [2]Shandong Provincial Key Lab of Special Welding Technology,Harbin Institute of Technology at Weihai,Weihai,264209,China [3]Shandong Institute of Shipbuilding Technology,Harbin Institute of Technology at Weihai,Weihai,264209,China

出　　处：《Nano Materials Science》2024年第6期775-779,共5页纳米材料科学(英文版)

基　　金：supported by National Natural Science Foundation of China(grant Nos.51875130 and 52175307);Shandong Provincial Natural Science Foundation of China(No.ZR2019MEE091);the Taishan Scholars Foundation of Shandong Province(No.tsqn201812128)。

摘　　要：A new insulation packaging strategy for the stator windings of flat wire motors based on LTCC technology was studied for the first time.The study aimed to replace traditional plastic packaging methods and avoid aging issues by fabricating a novel multilayer laminated Cu coil/CaO–Li_(2)O–B_(2)O_(3)–SiO_(2)glass-ceramic structure.The analysis of the interface microstructure of the laminated structure revealed that the CaO–Li_(2)O–B_(2)O_(3)–SiO_(2)glass-ceramic matrix consisted of a crystalline phase of CaSiO_(3)and an amorphous phase of SiO_(2).The interface between the Cu coil and CaO–Li_(2)O–B_(2)O_(3)–SiO_(2)glass-ceramic exhibited good bonding with no formation of secondary phases.Additionally,the strong bonding between the Cu coil and CaO–Li_(2)O–B_(2)O_(3)–SiO_(2)glass-ceramic was attributed to the diffusion of Cu atoms at the interface.The novel multilayer laminated structure based on LTCC technology proposed in this study can help achieve high-reliability insulation packaging for the stator windings of future high-power density and miniaturized flat wire motors.

关 键 词：LTCC technology Glass Sintering MULTILAYERS Interface diffusion 

分 类 号：TG1[金属学及工艺—金属学]