Nb纳米颗粒对Sn58Bi/Cu接头组织及性能的影响  

Effect of Nb nanoparticles on microstructure and mechanical properties of Sn58Bi/Cu joint

作　　者：薛行雁 程东海[2] 张冠星 李正兵 董宏伟 XUE Hangyan;CHENG Donghai;ZHANG Guanxing;LI Zhengbing;DONG Hongwei(State Key Laboratory of Advanced Brazing Metals&Technology,Zhengzhou Research Institute of Mechanical Engineering Co.,Ltd.,Zhengzhou 450001,China;School of Aeronautical Manufacturing Engineering,Nanchang Hangkong University,Nanchang 330063,China)

机构地区：[1]郑州机械研究所有限公司,新型钎焊材料与技术国家重点实验室,郑州450001 [2]南昌航空大学航空制造工程学院,南昌330063

出　　处：《焊接》2025年第1期17-21,共5页Welding & Joining

基　　金：国家自然科学基金资助项目(51865034);宁波市重大科技任务公关项目(2022Z103)。

摘　　要：【目的】旨在探究Nb纳米颗粒含量对Sn58Bi/Cu接头时效过程中组织及性能的影响,改善接头组织及性能。【方法】利用扫描电镜、能谱分析、XRD分析等分析方法,观察Nb纳米颗粒含量对Sn58Bi/Cu接头微观组织的影响规律;采用万能力学试验机测试分析Nb纳米颗粒含量对Sn58Bi/Cu接头抗剪强度的影响。【结果】研究结果表明,Nb纳米颗粒可促使Sn58Bi/Cu焊缝内生成细小Nb_(3)Sn化合物,恒温时效过程中可减缓焊缝组织粗化,降低接头界面金属间化合物(Intermetallic compound,IMC)层生长速率,抑制界面Bi相偏析,减少界面气孔、裂纹等缺陷,提高接头服役性能;恒温时效温度120℃时,当Nb纳米颗粒添加量(质量分数,%)为0.9%时,Sn58Bi-0.9Nb/Cu接头界面IMC层生长速率为0.13μm^(2)/h,较相同时效条件下Sn58Bi/Cu接头降低45%;时效15 d后,Sn58Bi-0.9Nb/Cu接头抗剪强度为9.3 MPa,较相同时效条件下Sn58Bi/Cu接头提升84%。【结论】经研究,Sn58Bi-0.9Nb/Cu接头抗剪强度较高。[Objective]The aim was to investigate effect of content of Nb nanoparticles on microstructure and properties of Sn58Bi/Cu joints during aging process and improve microstructure and properties of SN58Bi/Cu joints.[Methods]SEM,EDS and XRD were used to observe effect of content of Nb nanoparticles on microstructure of Sn58Bi/Cu joints.Universal testing machine was used to analyze effect of Nb nanoparticles on shear strength of Sn58Bi/Cu joints.[Results]The results showed that Nb_(3)Sn nano-compounds were generated in the weld of Sn58Bi-Nb/Cu after the addition of Nb nanoparticles,which could slow down microstructure coarsening of the weld,reduce growth rate of interfacial intermetallic compound(IMC)layer,inhibit Bi phase segregation,reduce interfacial pores and cracks,and improve service performance of the joints during aging process.At the aging temperature of 120℃,when the addition(wt.%)of Nb nanoparticles was 0.9%,IMC layer growth rate of Sn58Bi-0.9Nb/Cu joints was 0.13μm^(2)/h,which was 45%lower than that of Sn58Bi/Cu joint under the same aging conditions.After aging for 15 d,shear strength of Sn58Bi-0.9Nb/Cu joints was 9.3 MPa,which was 84%higher than that of Sn58Bi/Cu joint under the same aging conditions.[Conclusion]According to the research,Sn58Bi-0.9Nb/Cu joints had higher shear strength.

关 键 词：Nb纳米颗粒 时效过程 生长速率 焊缝组织 服役性能 

分 类 号：TG425[金属学及工艺—焊接]