电流密度对无氰电镀铜镀层组织形貌及结合力的影响研究  

Research on the Eff ect of Current Density on the Morphology and Adhesion of Cyanide Free Electroplated Copper Coatings

作　　者：李玮儒 孙涛[1] 沈以赴[1] Li Weiru;Sun Tao;Shen Yifu(Nanjing University of Aeronautics and Astronautics,Jiangsu,211106;AECC Harbin Dongan Engine Co.,Ltd.,Heilongjiang,150060)

机构地区：[1]南京航空航天大学,江苏211106 [2]中国航发哈尔滨东安发动机有限公司,黑龙江150060

出　　处：《当代化工研究》2025年第1期58-60,共3页Modern Chemical Research

摘　　要：使用无氰镀铜镀液LD-5101M,研究了电流密度对铁基镀铜层组织形貌及结合力的影响。结果表明:过高或过低的电流密度不利于镀层成形,当电流密度为1 A/dm2时,镀层表面结晶最为细致,晶粒尺寸较为均匀,进而在宏观上表现出镀层表面更加光滑平整;界面附近元素充分扩散及加在试片上的阴极电位使试片被还原成活化态是镀层具有良好结合力的主要因素。Using cyanide-free copper plating solution LD-5101M,the effect of current density on the organization and morphology of iron-based copper plating layer and the bonding force was studied.The results show that:too high or too low current density is not conducive to the for-mation of the plating layer,when the current density is 1 A/dm2,the surface of the plating layer is the most detailed crystallization,the grain size is more uniform,which in turn shows that the surface of the plating layer is smoother and more even in the macroscopic sense;the full diffusion of the elements near the interface and the cathodic potential added to the specimen make the specimen to be reduced to the activated state are the main fac-tors of the plating layer has a good bonding force.

关 键 词：无氰镀铜 电流密度 组织形貌 结合力 

分 类 号：TQ[化学工程]