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作 者:李杰 吴春燕 张国永 董泽 魏玮 朱剑明 陈贤进 LI Jie;WU Chunyan;ZHANG Guoyong;DONG Ze;WEI Wei;ZHU Jianming;CHEN Xianjin(Zhe Jiang Academy of Building Research&Design Co.Ltd.,Hangzhou 310012,China;Jin Hua Communications Investment Group Co.Ltd.,Jinhua 321015,China;Zhe Jiang Yi He New Materials Co.Ltd.,Jinhua 321000,China)
机构地区:[1]浙江省建筑科学设计研究院有限公司,浙江杭州310012 [2]金华交投华东国际联运新城建设有限公司,浙江金华321015 [3]浙江忆赫新材料有限公司,浙江金华321000
出 处:《新型建筑材料》2025年第1期89-91,101,共4页New Building Materials
摘 要:膨胀珍珠岩颗粒与有机胶合体系复配改性后,经过模压静置加压、保压脱模、热反应固化成型得到有机胶合阻燃热固复合保温板。研究了膨胀珍珠岩颗粒密度、模压比以及用胶量对热固复合保温板力学性能和导热性能的影响,并进行微观分析。结果表明:复配改性阻燃胶合体系能够有效胶结膨胀珍珠岩颗粒,制备的热固复合保温板密度低,抗压强度可达0.31 MPa,导热系数仅为0.054 W/(m·K),且具备A级不燃性能,应用于建筑外墙外保温前景可观。In this paper,the organic bonded flame-retardant thermosetting composite thermal insulation board was prepared by mold pressing,standing pressing,maintaining pressure and demolding,and thermal reaction after compound modification of the organic bonding system with expanded perlite particles.The influences of the density of expanded perlite particles,the molding pressure ratio and the amount of glue used on the mechanical properties and thermal conductivity of the thermosetting composite thermal insulation board were studied and analyzed,and the microstructure analysis of the experimental results was carried out.The results show that the compound modified flame-retardant gluing system could effectively bond the loose expanded perlite particles to make them compact.The prepared thermosetting composite thermal insulation board has low density,excellent strength performance(reaching 0.31 MPa),low thermal conductivity(0.054 W/m·K),and also has Class A non-combustible performance.It has a promising prospect for application in the external thermal insulation of building exteriors.
关 键 词:有机胶合 热固复合 阻燃 保温板 导热 力学性能
分 类 号:TU55[建筑科学—建筑技术科学]
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