Cu-PET-Cu复合薄膜镀层厚度对其力-电性能的影响  

Effects of Coating Thickness on Mechanical-Electrical Properties of Cu-PET-Cu Composite Films

作　　者：苏曹兵 董淑宏 SU Caobing;DONG Shuhong(Jiangnan Key Laboratory of Advanced Food Manufacturing Equipment and Technology,School of Mechanical Engineering,Jiangnan University,Wuxi 214122,China)

机构地区：[1]江南大学机械工程学院,江苏省食品先进制造装备与技术重点实验室,江苏无锡214122

出　　处：《真空》2025年第1期21-25,共5页Vacuum

基　　金：航空航天结构力学及控制国家重点实验室开放课题(MCMS-E-0123Y03)。

摘　　要：利用电子束蒸发技术制备了三种不同Cu膜厚度的Cu-PET-Cu复合薄膜,通过实验和分子动力学模拟方法,研究了Cu-PET-Cu复合薄膜的力学及电学性能。结果表明:铜膜较薄时,薄膜沉积不均匀,表面凹陷多,随厚度增加薄膜表面变得平整;随Cu膜厚度增加,复合薄膜抗拉强度增大,但延伸率随之降低;膜厚为6.069μm时复合薄膜抗拉强度最高,为250 MPa,延伸率为20%;分子动力学模拟结果与实验现象趋势一致;复合薄膜电阻率随Cu膜厚度增加先降低后升高,测得最小电阻率为1.834×10^(-6)Ω∙m,较纯铜电阻率更高。Three Cu-PET-Cu composite films with different thicknesses of Cu film were prepared by electron beam evaporation.The mechanical and electrical properties of Cu-PET-Cu composite films were studied by experiments and molecular dynamics simulation.The results show that the uneven deposition and rough surface are observed for the thin film,and the surface becomes flat with increasing Cu thickness.As the thickness of the Cu film increases,the tensile strength of the composite film increases,while the elongation decreases.The composite film has a highest tensile strength of 250 MPa and elongation of 20%when the thickness of composite film is 6.069μm.The results of molecular dynamics simulation are consistent with those obtained by experiments.The resistivity of composite films decreases first,and then increases with increasing copper layer thickness.The minimum resistivity is 1.834×10^(-6)Ω·m,which is higher than that of pure copper.

关 键 词：复合薄膜 抗拉强度 电阻率 实验 分子动力学模拟 

分 类 号：TH145[一般工业技术—材料科学与工程]