基于液态金属对流的电子设备冷却研究进展  

Research progress on cooling of electronic equipment based on liquid metal convection

作　　者：常向廷 董伟[1] 韩俊杰[1] 董进喜[1] 刘治虎[1] 赵航[1] CHANG Xiangting;DONG Wei;HAN Junjie;DONG Jinxi;LIU Zhihu;ZHAO Hang(Aeronautics Computing Technique Research Institute,Aviation Industry Corporation of China,Xi'an 710065,China)

机构地区：[1]航空工业集团公司西安航空计算技术研究所,西安710065

出　　处：《科技导报》2024年第24期30-45,共16页Science & Technology Review

基　　金：中国航空研究院航空科学基金项目(2023Z008031001)。

摘　　要：受益于液态金属优异的导热和流动性能,液态金属对流冷却为电子器件和设备的高热流密度热管理难题提供了新的解决方案。介绍了液态金属对流的传热和流动特性,相比于传统工质,液态金属的高热导率使得对流的总体热阻更低,因此产生更好的传热效果。总结了基于液态金属对流的驱动技术、复合式冷却技术和强化冷却技术的相关研究进展,简述了液态金属对流在电子设备冷却领域的应用现状,并展望了液态金属对流冷却的发展前景。Benefiting from the excellent thermal conductivity and flow properties of liquid metal,liquid metal convection cooling offers a new solution to the high heat flux thermal management of electronic devices and equipment.In this paper,the heat transfer and flow characteristics of liquid metal convection were introduced.Compared to traditional fluids,the high thermal conductivity of liquid metals resulted in lower overall thermal resistance,and the heat transfer performance was better.The relevant research progress of driving technology,hybrid cooling technology and heat transfer enhancement technology based on liquid metal convection were summarized.The application status of liquid metal convection in the field of electronic equipment cooling was briefly described.Finally,the challenges and development prospects of liquid metal convection cooling were discussed.

关 键 词：液态金属 对流传热 电子设备 高热流密度 

分 类 号：TK124[动力工程及工程热物理—工程热物理] TN03[动力工程及工程热物理—热能工程]