氨基磺酸盐体系电镀铟工艺及镀层微观结构  

Microstructure of indium coating electroplated from sulfamate-based bath

作　　者：邹忠利[1] 仝昆民 米志娟 单玺畅 ZOU Zhongli;TONG Kunmin;MI Zhijuan;SHAN Xichang(College of Materials Science and Engineering,North Minzu University,Yinchuan 750021,China)

机构地区：[1]北方民族大学材料科学与工程学院,宁夏银川750021

出　　处：《电镀与涂饰》2025年第1期45-49,共5页Electroplating & Finishing

基　　金：宁夏回族自治区自然科学基金项目(2023AAC03265);北方民族大学研究生创新项目(YCX23116)。

摘　　要：[目的]传统氨基磺酸盐体系电镀铟的主盐氨基磺酸铟价格昂贵。[方法]采用氨基磺酸钠为配位剂、In_(2)(SO_(4))_(3)·9H_(2)O为主盐在铜基体上电镀铟。研究论镀液组成及pH对沉积速率的影响。[结果]电镀In的较优配方为:氨基磺酸钠210 g/L,In_(2)(SO_(4))_(3)·9H_(2)O 130 g/L,NaCl 150 g/L,有机胺类添加剂适量,pH 1.5。循环伏安曲线测量结果表明,In在该体系中的电沉积是不可逆的电极反应过程。在较优配方下所得In镀层为银白色,厚度3~4μm,表面较平整均匀、结晶度高,结合力良好。[结论]本工艺采用价格相对低廉的氨基磺酸钠和硫酸铟替代昂贵的氨基磺酸铟,有利于电镀In工艺的推广应用。[Objective]Indium sulfamate used as the main salt of tradition indium electroplating is expensive.[Method]Indium electroplating was carried out on copper substrate in a bath using sodium sulfamate as complexing agent and In_(2)(SO_(4))_(3)·9H_(2)O as main salt.The effects of bath composition and pH on the electrodeposition rate were studied.[Result]The bath composition was optimized as follows:sodium sulfamate 210 g/L,In_(2)(SO_(4))_(3)·9H_(2)O 130 g/L,NaCl 150 g/L,appropriate amount of organic amine as additive,and pH 1.5.The cyclic voltammetric measurement results showed that the electrodeposition of indium in this bath was an irreversible electrode reaction process.The In coating electroplated from the optimized bath was silvery white,with a thickness of 3 to 4μm,a relatively smooth and uniform surface,high crystallinity,and good adhesion.[Conclusion]The relatively inexpensive sodium sulfamate and indium sulfate were used to replace the expensive sodium sulfamate in the given bath,which is conducive to the popularization and application of indium electroplating technology.

关 键 词：电镀 铟 氨基磺酸盐 沉积速率 微观结构 

分 类 号：TQ153.19[化学工程—电化学工业]