检索规则说明:AND代表“并且”;OR代表“或者”;NOT代表“不包含”;(注意必须大写,运算符两边需空一格)
检 索 范 例 :范例一: (K=图书馆学 OR K=情报学) AND A=范并思 范例二:J=计算机应用与软件 AND (U=C++ OR U=Basic) NOT M=Visual
作 者:Guilei Guo Yijie Liu Yafei Ding Wenjie Liu Guimei Zhu Xiaoli Hao Xingyi Huang Jianfei Xia Baowen Li Tong-Yi Zhang Bin Sun
机构地区:[1]College of Electronics and Information,Qingdao University,266071 Qingdao,PR China [2]Department of Polymer Science and Engineering,Shanghai Key Laboratory of Electrical Insulation and Thermal Aging,Shanghai Jiao Tong University,200240 Shanghai,PR China [3]School of Electrical Engineering,Southwest Jiaotong University,611756 Chengdu,China [4]Department of Materials Science and Engineering,Southern University of Science and Technology,518055 Shenzhen,PR China [5]School of Microelectronics,Southern University of Science and Technology,518055 Shenzhen,PR China [6]College of Chemistry and Chemical Engineering,Shandong Sino-Japanese Center for Collaborative Research of Carbon Nanomaterials,Instrumental Analysis Center of Qingdao University,Qingdao University,266071 Qingdao,PR China [7]Department of Physics,Southern University of Science and Technology,518055 Shenzhen,PR China [8]Guangzhou Municipal Key Laboratory of Materials Informatics,Sustainable Energy and Environment Thrust,Advanced Materials Thrust,Hong Kong University of Science and Technology(Guangzhou),511400 Guangzhou,PR China [9]Weihai Innovation Research Institute of Qingdao University,264200 Weihai,PR China
出 处:《npj Flexible Electronics》2024年第1期568-576,共9页npj-柔性电子(英文)
基 金:supported by the Natural Science Foundation of Shandong Province(ZR2020ME193)。
摘 要:Efficient thermal management has becomeone of the most critical issues of electronics because of the high heat flux generated from highly integrated,miniaturized,and increased power.Here we report highly flexible composites with aligned and overlapping interconnected boron nitride nanosheets(BNNSs)assembled in wrinkle structures.Besides high in-plane thermal conductivity of more than 26.58Wm^(−1) K^(−1),such structure rendered enhanced through-plane conduction along with increasing pre-stain.As thermal interface materials(TIMs)of both rigid and flexible devices,the composites revealed an outstanding thermal cooling capability outperforming some commercial TIMs.During a record-long bending process of more than 3000 cycles,the maximum temperature fluctuation of the flexible device with 100%-prestrained composite was only within 0.9℃,less than one-third of that with commercial thermal pad.Moreover,the composite revealed a superior impermeability for flexible seals.Our results illustrate that the composites could be an ideal candidate for the thermal management of emerging flexible electronics.
关 键 词:COMPOSITES composite thermal
分 类 号:TB3[一般工业技术—材料科学与工程]
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在链接到云南高校图书馆文献保障联盟下载...
云南高校图书馆联盟文献共享服务平台 版权所有©
您的IP:3.148.196.9