低膨胀高流平性加成型有机硅灌封胶的研制  

Preparation of Polyaddition Silicone Encapsulant with Low Thermal Expansion and High Levelling

作　　者：李培 曾延辉 LI Pei;ZENG Yanhui(Shenzhen Tianding New Material Co.,Shenzhen 518000,China)

机构地区：[1]深圳天鼎新材料有限公司,广东深圳518000

出　　处：《有机硅材料》2025年第1期29-33,共5页Silicone Material

摘　　要：以端乙烯基硅油和含氢硅油为主要原料、硅微粉为填料,制得低膨胀高流平性加成型有机硅灌封胶,研究了乙烯基硅油搭配、填料改性剂用量、填料形态及用量搭配对有机硅灌封胶性能的影响。结果表明,有机硅灌封胶的较佳配方为双端与单端乙烯基硅油质量比0.6:0.4,十二烷基三甲氧基硅烷用量为填料质量的1.5%,填料采用15μm球形硅微粉、15μm普通硅微粉与40μm普通硅微粉按质量比20:25:25复配,此时制得的有机硅灌封胶黏度为1800mPa·s,邵氏A硬度为25,密度为1.6g/cm^(3),流平性为21.8cm,线性膨胀系数为115×10^(-6)/K,拉伸强度为1.7MPa,热导率为0.84W/(m·K),体积电阻率为1×10^(14)Ω·cm。The polyaddition silicone encapsulant with low thermal expansion and high leveling was prepared by vinyl-termina-ted silicone oil and hydrogen silicone oil as the raw materials,and silicon micro powder as the filler.The effects of fller modifi-er,vinyl silicone oil,filler morphology and content on the properties of silicone encapsulant were studied.The results show that the optimal formula was that dodecyl trimethoxysilane with 1.5 wt%of the filler,with a mass ratio of 0.6:0.4 between double-single ended vinyl silicone oil.The filler has a mixture of 15μm spherical,15μm ordinary,and 40μm ordinary silicon micro powder in a mass ratio of 20:25:25.The silicone sealant has a viscosity of 1800 mPa s,Shore hardness of 25 A,a density of 1.6 g/cm^(3),a levling of21.8 cm,a linear expansion coefficient of115×10^(-6)/K,a tensile strength of1.7 MPa,a thermal conductivity of 0.84 W/(m·K),and a volume resistivity of 1×10^(14) Ω·cm.

关 键 词：低膨胀 高流平性 单端乙烯基硅油 改性硅微粉 加成型 有机硅 灌封胶 

分 类 号：TQ433.438[化学工程]