硬脆元件表面低温等离子体及其复合加工技术研究现状分析  

Research Status Analysis of Low Temperature Plasma and Its Compound Processing Technology on the Surface of Hard and Brittle Components

作　　者：李伟[1,2] 胡小龙[1] 段辉高 邓辉 黄向明 任莹晖[1] 艾哈迈德·穆罕默德·马哈茂德·易卜拉欣[4] LI Wei;HU Xiaolong;DUAN Huigao;DENG Hui;HUANG Xiangming;REN Yinghui;Ahmed Mohamed Mahmoud Ibrahim(College of Mechanical and Vehicle Engineering,Hunan University,Changsha 410082;Greater Bay Area Institute for Innovation,Hunan University,Guangzhou 511300;College of Engineering,Southern University of Science and Technology,Shenzhen 518055;Faculty of Engineering,Minia University,El-Minya 61519 Egypt)

机构地区：[1]湖南大学机械与运载工程学院,长沙410082 [2]湖南大学粤港澳大湾区创新研究院,广州511300 [3]南方科技大学工学院,深圳518055 [4]米尼亚大学工程学院,埃及米尼亚61519

出　　处：《机械工程学报》2024年第23期246-261,共16页Journal of Mechanical Engineering

基　　金：国家自然科学基金(52275421,52005174,51875192);湖南省杰出青年基金(2022JJ10010);湖南省重点研发计划(2022WK2003);中国科学院战略性先导科技专项子任务(XDA25020317-05);湖南省自然科学基金(2020JJ4193、2021JJ40064);广东省自然科学基金(2023A1515011193)资助项目。

摘　　要：在芯片、光刻机、激光核聚变装置等国家重点工程驱动下,高精高质硬脆元件需求日益迫切,但是现有半导体晶圆、光学元件等硬脆元件表面加工技术还存在诸多局限,远不能满足实际需求。低温等离子体加工技术具有无机械接触和灵活性强等优势,可以实现硬脆材料元件表面的高效率近无损伤加工,但在加工均匀性、面型精度等方面仍面临着严峻挑战。因此非常有必要深入分析等离子体加工机理、工艺及装备方面的研究现状、存在的问题及发展趋势,为硬脆元件表面的高精高质加工提供技术参考和借鉴。分析了等离子体原子尺度下的加工机理,总结了硬脆元件等离子体加工技术及装备方面的研究现状;在此基础上,探讨了等离子体及其加工装备存在的问题,由此指出等离子体加工技术的发展方向,以期促进等离子体技术在硬脆元件加工方面的推广应用,助力我国半导体晶圆、光学元件等硬脆元件超精密加工制造水平的提升,支持国家重点工程的发展。Driven by the chip,lithography,laser fusion device and other national key projects,the demand for high-precision and high-quality hard and brittle components is becoming increasingly urgent.However,the existing technologies used for semiconductor wafers,optical components and other hard and brittle components surface machining still have many limitations and are far from meeting the actual needs.Low-temperature plasma processing technology has the advantages of no mechanical contact and strong flexibility,and can achieve high efficiency and near-damage-free processing of hard and brittle material component surfaces.However,it still faces serious challenges in processing uniformity and surface accuracy.Therefore,it is necessary to deeply analyze the research status,problems and development trends of plasma machining mechanism,processes and equipment,so as to provide technical reference and guidance for the high-precision and high-quality machining of hard and brittle component surfaces.This paper analyzes the plasma processing mechanism at the atomic scale and summarizes the current research status of plasma processing technology and equipment for hard and brittle components.On this basis,the problems of plasma and its processing equipment have been discussed.The development directions of plasma processing technology are thus pointed out to promote the popularization and application of plasma technology in the processing of hard and brittle components.Furthermore,it aims to boost the manufacturing level of ultra-precision machining of hard and brittle components such as semiconductor wafers and optical components in China and support the development of national key projects.

关 键 词：硬脆元件 等离子体 抛光 改性 研磨 

分 类 号：TG175[金属学及工艺—金属表面处理] TQ127[金属学及工艺—金属学] TQ171[化学工程—无机化工]