面向航天应用的COTS器件锡须抑制方法  

Tin Whisker Mitigation Method for COTS Devices Using for Aerospace

作　　者：朱永鑫 翁正 万任新 刘红民 ZHU Yongxin;WENG Zheng;WAN Renxin;LIU Hongmin(National Space Science Center,CAS,Beijing,100190)

机构地区：[1]中国科学院国家空间科学中心,北京100190

出　　处：《电子工艺技术》2025年第1期11-14,共4页Electronics Process Technology

基　　金：北京市自然科学基金青年项目(4234092)。

摘　　要：随着航天型号任务对成本的控制,商业货架产品(COTS)器件应用越来越多。该类产品器件引脚镀层多为纯锡镀层,易于生长锡须,引发可靠性问题,因此研究工程上实际可行的抑制方法很有必要。对比了热真空试验条件下去应力退火以及两种涂覆材料对锡须生长的影响。结果表明,75℃焊后烘烤对锡须生长抑制作用有限。不同涂覆材料对锡须生长抑制效果不同,手工涂覆DBSF-6101三防漆可减缓锡须生长,200周次热循环后锡须呈小丘状,未刺破漆膜。但手工涂覆存在一定不均匀性,未涂三防漆部位锡须生长明显。聚对二甲苯对锡须生长具有明显抑制效果,200周次热真空试验后,未观察到锡须萌生及生长。With the cost control of aerospace program,commercial off the shelf(COTS)devices are more and more widely used.Generally,the plating layer for these components pin is the pure tin,which is prone to grow tin whisker and induce reliability problem.Hence,pursuing the mitigation method is meaningful for engineering project.Stress relief annealing and two conformal coating materials are selected to mitigate the tin whisker growth.The result indicate that 75℃baking cannot mitigate the tin whisker growth.The effect of different conformal coating materials are different,the manual coating DBSF-6101 can slow down the tin whisker growth,which appears hillock morphology and the coating layer are not pierced after 200 thermal vacuum cycles.However,manual coating is non-uniform and tin whisker growth is obvious for position without coating.The parylene coating mitigation effect is obvious and the layer appears no tin whisker after 200 thermal vacuum cycles.

关 键 词：器件 纯锡 锡须 抑制方法 

分 类 号：TN605[电子电信—电路与系统]