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作 者:栗凡 周星辰 屈云鹏 姚宇清 李留辉 LI Fan;ZHOU Xingchen;QU Yunpeng;YAO Yuqing;LI Liuhui(Xi’an Microelectronics Technology Institute,Xi’an 710129,China)
出 处:《电子工艺技术》2025年第1期31-35,共5页Electronics Process Technology
摘 要:研究了长针板间连接器的激光软钎焊参数优化和应用可靠性。设计了适应长针板间连接器的激光焊接设备方案,计算了激光焊接所需的焊锡长度,优化预热和焊接温度曲线,将三段式焊接优化为五段式焊接,得到了不同覆铜层数印制板的激光焊接参数,对激光焊接后的印制板、焊点、连接器开展了外观检查与可靠性验证试验。结果表明,激光软钎焊技术可应用于长针板间连接器的焊接,提高了焊点质量,满足高可靠应用需求。The optimization of laser soldering parameters and the application reliability of long-pin inter-board connectors are studied.The laser soldering equipment scheme suitable for the connectors is designed,and the solder length required for laser soldering is calculated.Then the preheating and soldering temperature profiles are optimized.The three-stage soldering is optimized to the five-stage soldering,and the laser soldering parameters of the printed board with different copper clad laminates are obtained.The appearance inspection and reliability verification test of the printed board,solder joint and connector after laser soldering are carried out.The results show that laser soldering technology can be applied to the soldering of long-pin inter-board connectors,improve the quality of solder joints,and meet the requirements of high-reliability applications.
分 类 号:TN605[电子电信—电路与系统]
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