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作 者:尤玉山 许红祥 杨帆 王亚松 邝小乐 刘超 YOU Yushan;XU Hongxiang;YANG Fan;WANG Yasong;KUANG Xiaole;LIU Chao(The 8th Research Academy of CSSC,Nanjing 21153)
机构地区:[1]中国船舶集团有限公司第八研究院,南京21153
出 处:《电子工艺技术》2025年第1期36-38,50,共4页Electronics Process Technology
摘 要:采用Nd:YAG脉冲激光对T2紫铜进行封焊试验,研究了峰值功率、脉冲宽度、焊接速度对焊接效果的影响。在此基础上研究盒体装配间隙及预热温度对紫铜封焊效果的影响。结果表明,当峰值功率在4.2 kW、脉冲宽度在14 ms、焊接速度在1 mm/s时,焊缝无裂纹、空洞等缺陷,气密性满足要求;当盒体装配间隙在0.02~0.06 mm之间时,可以实现紫铜的气密性封焊;对紫铜进行预热处理,可以降低峰值功率,减少设备的负荷和能耗;在此参数下封焊的紫铜盒体经过温度冲击及随机振动试验后均能满足气密性要求,实现了紫铜稳定可靠的气密性封焊。The sealing test of T2 copper is carried out by using Nd:YAG pulse laser,and the infl uence of peak power,pulse width and welding speed on the welding effect is studied.On this basis,the infl uence of box assembly gap and preheating temperature on the sealing effect of copper is studied.The results show that when the peak power is 4.2 kW,the pulse width is 14 ms,and the welding speed is 1 mm/s,the weld has no defects such as cracks and voids,and the airtightness meets the requirements;when the box assembly gap is between 0.02~0.06 mm,the airtight sealing of copper can be achieved;preheating copper can reduce the peak power,reduce the load and energy consumption of the equipment;the copper box sealed under these parameters can meet the airtightness requirements after temperature shock and random vibration tests,and the stable and reliable airtight sealing of copper is achieved.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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