热压温度和压力对芳纶绝缘纸介电性能的影响  

Influence of Hot Pressing Temperature and Pressure on Dielectric Performance of Aramid Insulating Paper

作　　者：马婕 史晟 黄猛 齐波[1] 李成榕[1] MA Jie;SHI Sheng;HUANG Meng;QI Bo;LI Chengrong(State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources,North China Electric Power University,Beijing 102206,China)

机构地区：[1]华北电力大学新能源电力系统全国重点实验室,北京102206

出　　处：《高压电器》2025年第2期158-164,共7页High Voltage Apparatus

基　　金：北京市自然科学基金(3212035)。

摘　　要：为深入研究芳纶绝缘纸热压过程对其介电性能的影响,文中制备了不同热压温度和热压压力的芳纶绝缘纸,测试了其紧度和介电性能,并结合扫描电子显微镜进行微观形貌分析。研究结果表明,在热压温度为220~260℃,压力为8~16 MPa范围内,随热压温度及压力的提升,绝缘纸介电常数受到结晶度和纸中孔隙的影响,整体呈现小幅度上升趋势;交流击穿强度受到纸中孔隙的影响,随热压参数的提升而不断提高并趋向稳定。热压过程中,温度和压力协同作用于绝缘纸,其中温度对交流击穿强度的影响较大。For deeply studying the influence of hot pressing process on the dielectric performance of aramid insulating paper,the aramid insulating paper with different hot pressing temperatures and pressures is prepared,its compactness and dielectric performance are tested,and the micro morphology analysis is performed by scanning electron microscope.The research results show that when the hot pressing temperature is within 220-260℃and the pressure is within 8-16 MPa,with the increase of hot pressing temperature and pressure,the dielectric constant of the insulating paper shows overall a small rise trend due to the influence of crystallinity and pores in the paper.The AC breakdown strength,due to the influence of the pores in the paper,improves continuously with the increases of hot pressing parameters and tends to be stable.In the hot pressing period,temperature and pressure act together on the insulating paper,in which the influence of temperature on the AC breakdown strength is larger.

关 键 词：芳纶绝缘纸 介电常数 击穿强度 热压 

分 类 号：TM215.6[一般工业技术—材料科学与工程]