微电子元件注塑封装模流仿真工艺优化研究  

Optimization of simulation process for injection molding packaging of microelectronic component

作　　者：胡鲲鸣 王迪 金镖 阮剑波 刘万强 谢鹏程[2,4] HU Kunming;WANG Di;JIN Biao;RUAN Jianbo;LIU Wanqiang;XIE Pengcheng(Haitian Plastics Machinery Group Co,Ltd,Ningbo 315800,China;College of Mechanical and Electrical Engineering,Beijing University of Chemical Technology,Beijing 100029,China;Ningbo Zhafir Plastics Machinery Manufacturing Co,Ltd,Ningbo 315830,China;State Key Laboratory of Organic-Inorganic Composites,Beijing University of Chemical Technology,Beijing 100029,China)

机构地区：[1]海天塑机集团有限公司,浙江宁波315800 [2]北京化工大学机电工程学院,北京100029 [3]宁波长飞亚塑料机械制造有限公司,浙江宁波315830 [4]有机无机复合材料国家重点实验室,北京100029

出　　处：《中国塑料》2025年第1期44-47,共4页China Plastics

基　　金：宁波市科技创新2025重大专项(2023Z029)。

摘　　要：将热致性液晶聚合物(TLCP)微电子元件作为研究对象,利用Moldflow模拟微电子元件注塑流程,对比不同内芯结构对微电子元件注塑的影响,对微电子元件注塑过程中成型效率与成型质量进行分析。通过对比三触点嵌芯结构和两触点嵌芯结构得出最佳注塑方案为两触点嵌芯结构,两触点嵌芯结构的充填时间为0.020 4 s,达到顶出时间为0.123 5 s,平均体积收缩率为4.414%,综合翘曲变形为0.011 5 mm,两触点嵌芯结构相较三触点嵌芯结构节省了充填时间,平均体积收缩率和综合翘曲变形分别降低了0.149%和0.002 7 mm,虽然与三触点嵌芯结构相比,两触点嵌芯结构中纤维分布均匀性较差,但得益于内芯边缘纤维分布集中,使其体积收缩与翘曲变形量减少,综合分析可知,两触点嵌芯结构为微电子元件注射成型最佳方案。Taking the microelectronic components based on a thermotropic liquid crystal polymer(TLCP)as a research object,the Moldflow analysis software was employed to simulate the injection molding process of the microelectronic components.The effect of different core structures on the injection molding of microelectronic components was com-pared,and the molding efficiency and molding quality of the microelectronic components in the injection molding process were analyzed.Through comparing the three-contact and two-contact inlay core structures,the optimal injection molding scheme was determined to be the two-contact inlay core structure.The two-contact inlay core structure had a filling time of 0.0204 s,an ejection time of 0.1235 s,an average volumetric shrinkage rate of 4.414%,and a comprehensive warpage deformation of 0.0115 mm.These were determined to be the optimal injection molding scheme for the micro-electronic components.The average volume shrinkage and integrated warpage deformation were reduced by 0.149%and 0.0027 mm,respectively.Although the two-contact inlay core structure showed poorer uniformity in fiber distribu-tion than the three-contact one,its volume shrinkage and warpage deformation were reduced due to the concentrated fiber distribution at the edge of the inner core.A comprehensive analysis indicated that the two-contact inlay core structure was the optimal scheme for the injection molding of microelectronic components.

关 键 词：MOLDFLOW 微电子元件 结构优化 纤维取向 翘曲变形 

分 类 号：TQ320.66[化学工程—合成树脂塑料工业]