PCB背钻流程优化研究  

Research on optimization of PCB back drilling process

作　　者：许敏 黄英海 陈丽琴 李晓维 XU Min;HUANG Yinghai;CHEN Liqin;LI Xiaowei(Jiujiang Sunshine Global Circuits Technology Co.,Ltd.,Jiujiang 332000,Jiangxi,China;Sunshine Global Circuits Co.,Ltd.,Shenzhen 518000,Guangdong,China)

机构地区：[1]九江明阳电路科技有限公司,江西九江332000 [2]深圳明阳电路科技股份有限公司,广东深圳518000

出　　处：《印制电路信息》2025年第2期30-34,共5页Printed Circuit Information

摘　　要：随着信号传输速率的提升,对多层印制电路板(PCB)背钻的要求越来越高。对背钻对位方式、背钻盖板和背钻专用钻头3方面展开研究,建立背钻对位方式的误差计算模型,分析不同盖板对背钻堵孔的影响,并设计了一款渐变式芯厚和渐变式沟幅比的背钻专用钻头。通过上述措施,改善背钻流程,简化图形电镀和碱性蚀刻工艺流程,得到厚径比为19∶1,最小通孔孔径为0.20mm,背钻孔径0.35mm,背钻深度3.60mm的背钻孔。确保达到经电镀处理,直接背钻不堵孔的品质标准。With the increase of signal transmission rate,the requirements for back drilling of multi-layer printed circuit boards(PCBs)are getting higher and higher.In this paper,the error calculation model of the back drilling alignment mode is established by studying the back drilling alignment mode,the back drilling cover plate and the special back drilling bit.The influence of different cover plates on the back drilling plugging hole is analyzed,and the special back drilling bit for back drilling with gradual core thickness and gradual groove width ratio is designed.Through these improvements,the improvement of the back drilling process of the PCB has been realized,the pattern plating and alkaline etching process have been removed,and the back drilling with a thickness-diameter ratio of 19:1,a minimum drilling hole diameter of 0.20 mm,a back drilling hole diameter of 0.35 mm,and a back drilling depth of 3.60 mm has been achieved,ensuring the quality standard of direct back drilling without plugging holes after electroplating.

关 键 词：背钻 对位 堵孔 盖板 

分 类 号：TN41[电子电信—微电子学与固体电子学]