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作 者:张亚辉 田伟臻 丁涛 ZHANG Yahui;TIAN Weizhen;DING Tao(Shenzhen Kinwong Electronic Co.,Ltd.,Shenzhen 518102,Guangdong,China)
机构地区:[1]深圳市景旺电子股份有限公司,广东深圳518102
出 处:《印制电路信息》2025年第2期35-39,共5页Printed Circuit Information
摘 要:随着印制电路行业的高速发展,激光加工成为重要工序。由于激光钻机电气结构复杂,调试技术层级高,在加工过程中出现偏孔现象时难以准确定位设备异常点。阐述激光钻机的结构和原理,分析钻孔上游工序对偏孔问题的影响和原因,提出针对性的解决方案和预防措施,收集改进前后的数据并进行对比,证实改进措施的实际效果。通过上述方案,快速解决激光钻孔偏孔问题,减少批量性报废。为印制电路行业提供有效控制激光钻孔偏孔问题的解决方案,增强企业在市场中的竞争力。同时,也为行业内人员提供参考和借鉴,以期推动我国印制电路领域技术的持续创新与发展。With the rapid development of printed circuit industry,laser processing has become an important process.Due to the complex electrical structure of laser drilling rig and high technical level of commissioning,it is difficult to accurately locate the abnormal points of equipment in case of hole deviation during processing.This paper analyzes the structure and principle of the laser drilling rig,studies the influence of the upstream drilling process on the hole deviation problem and its reason,puts forward a series of targeted solutions and preventive measures,and then collects the data before and after the improvement to verify the actual effect of the improvement measures.Through these solutions,the problem of laser hole deviation can be quickly solved and the batch scrap can be reduced.This paper provides a solution to effectively control laser drilling hole deviation for the printed circuit industry and enhance the competitiveness of enterprises in the market.At the same time,it also provides reference for personnel in the industry,and promotes the continuous innovation and development of technology in the field of printed circuit in China.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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