CAF和SIR测试失效分析方法  

Failure analysis methods using CAF and SIR testing

作　　者：严泽军 乐逸 贾亚波 YAN Zejun;LE Yi;JIA Yabo(Microtek Changzhou Products Service Co.,Ltd.,Changzhou 213031,Jiangsu,China)

机构地区：[1]麦可罗泰克(常州)产品服务有限公司,江苏常州213031

出　　处：《印制电路信息》2025年第2期59-64,共6页Printed Circuit Information

摘　　要：为验证印制板绝缘性是否可靠,采用导电阳极丝(CAF)和表面绝缘电阻(SIR)测试。经测试可知,CAF或电化学迁移(ECM)是导致绝缘失效的主要原因。探究CAF和ECM的形成机理,以及两者的区别,以快速、准确地识别失效原因。介绍CAF和SIR失效分析方法,尤其对分析流程、失效定位、切片分析、扫描电子显微镜(SEM)和能谱仪(EDS)分析进行详细阐述。研究结果显示,相较于垂直切片,采用水平切片发现异常的成功率更高;同时,使用热发射定位法和控制研磨深度的工具,可有效提升失效原因分析效率。To verify the reliability of the insulation of printed circuit boards,conductive anodic filamentation(CAF)and surface insulation resistance(SIR)tests are adopted.According to the test,CAF or electrochemical migration(ECM)is usually the main cause of insulation failures.The formation mechanism of CAF and ECM,as well as the difference between them is explored,so as to quickly and accurately identify the cause of failure.This paper describes the methods analyzing the failures in CAF and SIR testing,elaborating the analyzing process,failure positioning,the micro-section analysis,and scanning electron microscope(SEM)and energy dispersive spectrometer(EDS)analysis.The research results show that horizontal sectioning has a higher success rate of finding the anomalies than the vertical sectioning,and the adoption of thermal emission positioning method and the use of tools to control grinding depth can improve the efficiency of failure analysis.

关 键 词：导电阳极丝 电化学迁移 失效定位 切片分析 

分 类 号：TN41[电子电信—微电子学与固体电子学]