基于Mask-SIFT的LED芯片三维重建研究  

Research on 3D Reconstruction of LED Chips Based on Mask-SIFT

作　　者：甘胜斯 陈新度[1,2] 陈玉冰 吴磊[1,2] 张宇 邱伟彬[1,2] GAN Shengsi;CHEN Xindu;CHEN Yubing;WU Lei;ZHANG Yu;QIU Weibin(School of Electromechanical Engineering,Guangdong University of Technology,Guangzhou Guangdong 510006,China;State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment,Guangdong University of Technology,Guangzhou Guangdong 510006,China)

机构地区：[1]广东工业大学机电工程学院,广东广州510006 [2]广东工业大学,省部共建精密电子制造技术与装备国家重点实验室,广东广州510006

出　　处：《机床与液压》2025年第1期217-222,共6页Machine Tool & Hydraulics

基　　金：广东省基础与应用基础研究基金项目(2021A1515110035);佛山市重点领域科技攻关项目(2120001011009)。

摘　　要：针对二维图像难以准确表征LED芯片金属键合线的三维缺陷特征,以及三维传感器在LED芯片三维成像中存在成本昂贵和成像结构不完整等问题,提出一种基于图像的LED芯片三维重建方法。针对LED芯片图像采集过程中容易受载物台纹理影响的问题,提出一种改进的Mask-SIFT特征提取与匹配算法,利用掩膜有效过滤载物台纹理引入的噪声,提升特征提取速度。采用运动恢复结构算法计算特征点的三维坐标,生成LED芯片的稀疏点云。最后,通过多视角立体几何算法对稀疏点云稠密化,生成LED芯片的稠密点云,得到更完整的点云结构。结果表明:改进的Mask-SIFT能有效过滤背景噪声,节省了62.39%的重建时间,有效实现了LED芯片三维点云的重建。Aiming at the problems that 2D images are difficult to represent the 3D defect information of the wire-bonding,and the 3D sensors for 3D imaging of LED chips are expensive and 3D structure is incomplete,a 3D reconstruction method of LED chips based on image was proposed.Aiming at the problem that the image acquisition process of LED chips was easily affected by the texture of the acquisition platform,an improved Mask-SIFT algorithm was proposed for feature extraction and matching.The mask was used to effectively filter the noise introduced by the texture of the acquisition platform and improve the feature extraction speed.The 3D coordinates of the feature points were calculated by using the structure from motion algorithm to generate the sparse point cloud of LED chips.Finally,the dense point cloud of LED chips was generated by the multi-view stereo algorithm to densify the sparse point cloud,and a more complete point cloud structure was obtained.The results show that the improved Mask-SIFT algorithm can effectively filter the texture noise,saving 62.39%of the reconstruction time,and the 3D point cloud of LED chips is effectively reconstructed.

关 键 词：LED芯片 三维重建 掩膜 运动恢复结构 

分 类 号：TP391.4[自动化与计算机技术—计算机应用技术]