激光加工技术在光学元件制造中的进展与挑战  

Progress and Challenges of Laser Processing Technology in Optical Element Manufacturing

作　　者：高致远 GAO Zhiyuan(School of Environmental and Architectural Engineering,Shanghai University of Engineering Science,Shanghai 200093,China)

机构地区：[1]上海理工大学环境与建筑学院,上海200093

出　　处：《信息记录材料》2025年第2期9-11,共3页Information Recording Materials

摘　　要：针对光学元件制造中精度与功能化需求日益提高的现状,本文首先详细探讨了激光加工技术的基本原理,分析了其在光学元件制造中的显著优势。然后对技术的萌芽阶段、发展阶段和突破阶段的研究进展进行了系统梳理,涵盖了激光微纳制造、激光烧蚀、飞秒激光以及激光诱导等离子体沉积与反应沉积等方面的技术。最后探讨了当前技术面临的热影响区最小化、高反射率材料加工难度等挑战,并展望了未来在新材料和新工艺开发中的发展趋势。In response to the increasing demands for precision and functionality in optical element manufacturing,this paper first provides an in⁃depth discussion of the fundamental principles of laser processing technology,analyzes its significant advantages in optical element manufacturing.Then,a systematic review was conducted on the research progress during the nascent,developmental,and breakthrough stages of the technology.The review covers aspects such as laser micromachining,laser ablation,femtosecond laser technology,as well as laser⁃induced plasma deposition and reaction deposition techniques.Finally,this paper discusses the current challenges the technology faces,including the minimization of heat⁃affected zones and the difficulties in processing highly reflective materials,and anticipates future trends in the development of new materials and processes.

关 键 词：激光微纳制造 飞秒激光技术 光学元件精密加工 

分 类 号：TN249[电子电信—物理电子学]