基于“新工科”的电子封装技术实验教学改革与探索  

Reform and exploration of electronic packaging technology experimental teaching based on“New Engineering”

作　　者：石素君 李红[1] 赵修臣[1] 郑冰 许兴燕 SHI Sujun;LI Hong;ZHAO Xiuchen;ZHENG Bing;XU Xingyan(School of Materials Science&Engineering,Beijing Institute of Technology,Beijing 100081,China)

机构地区：[1]北京理工大学材料学院,北京100081

出　　处：《实验技术与管理》2023年第S1期29-33,共5页Experimental Technology and Management

基　　金：2018年北京理工大学深化教育教学改革专项(SG180308);2020年北京理工大学虚拟仿真实验教学项目“基于引线键合技术的金丝球焊关键工艺虚拟仿真实验”;2021年北京理工大学教改项目“基于‘新工科’理念的‘电子封装技术专业课程实验’课程建设与探索”

摘　　要：该文针对电子封装技术专业课程实验教学改革,制定了知识、能力和思政多维度教学目标,构建了以技术前沿为引领的全封装工艺流程知识体系,形成了以虚拟仿真、SPOC视频等现代信息技术为手段的线上线下多形态实验教学模式,建立了科学全面的实验教学评价体系,将价值引导贯穿人才培养全过程。该项改革大大提高了学生的自主学习能力、解决问题能力和探索创新能力。This paper focuses on the reform of experimental teaching in electronic packaging technology courses,and establishes multi-dimensional teaching objectives based on knowledge,ability,and ideological and political education.This paper constructs a full packaging process knowledge system led by the forefront of technology,forms an online and offline multimodal experimental teaching mode using modern information technologies such as virtual simulation and SPOC video,and establishes a scientific and comprehensive evaluation system for experimental teaching,Guides value throughout the entire process of talent cultivation.This reform has greatly improved students'self-learning ability,problem-solving ability,and exploratory innovation ability.

关 键 词：新工科 多维度 全工艺 新形态 

分 类 号：G642.0[文化科学—高等教育学]