铸造用无机黏结剂的研究应用及发展  

Research,Application and Development of Inorganic Binder for Casting Process

作　　者：龚小龙 胡胜利 樊自田[1] GONG Xiao-long;HU Sheng-li;FAN Zi-tian(State Key Laboratory of Materials Processing and Die&Mould Technology,School of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,Hubei,China;School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,Hubei,China)

机构地区：[1]华中科技大学材料科学与工程学院,材料成形与模具技术国家重点实验室,湖北武汉430074 [2]武汉理工大学材料科学与工程学院,湖北武汉430070

出　　处：《铸造》2025年第1期1-15,共15页Foundry

基　　金：国家自然科学基金(No.52275334,52205361,51075163和50575085)。

摘　　要：铸造用无机黏结剂,具有生产现场气味小、劳动条件友好和成本相对低廉等优势,是未来铸造造型材料发展的主要方向之一。与有机黏结剂(化学树脂类黏结剂)比较,无机黏结剂的黏结强度偏弱,对环境湿度相对敏感,尤其是有机黏结剂旧砂再生回用难度更大,制约了其推广应用。本文概述了铸造用无机黏结剂(主要是硅酸盐无机黏结剂)及其固化方法的研究及应用现状,介绍了正在研发的磷酸盐无机黏结剂和3D打印用无机黏结剂研究与应用情况,就无机黏结剂应用中的难点问题“旧砂再生回用”进行了较详细的比较分析,最后就铸造用无机黏结剂的发展方向阐明了作者的观点。Inorganic binder used in casting process has the advantages of low odor,labor-friendly conditions,and relatively low cost,which is one of the main development directions for casting molding materials in the future.However,compared to organic binders(such as resin binders),inorganic binders exhibit lower bonding strength and are more sensitive to environmental humidity.This sensitivity poses challenges,particularly in the reclamation of used sand,thus limiting their broader application.In this paper,the research and application status of inorganic binders(mainly silicate inorganic binders)and their curing methods are summarized.In addition,the research and application of phosphate inorganic binders and 3D printing inorganic binders that are being developed are introduced.Meanwhile,a detailed comparative analysis is conducted on the challenging issue of“reclamation for used sand”in the application of inorganic binders.Finally,the development direction of inorganic binders is clarified.

关 键 词：无机黏结剂 硅酸盐类 磷酸盐类 3D打印 旧砂再生 发展趋势 

分 类 号：TG221[金属学及工艺—铸造]