基于正交试验的立体光固化增材制造工艺参数优化研究  

Optimization of SLA Light Curing Additive Manufacturing Process Parameters Based on Orthogonal Experiment

作　　者：王迹[1] 张洋 程明[1] WANG Ji;ZHANG Yang;CHENG Ming(Sichuan Key Laboratory of Electrical Processing,School of Intelligent Manufacturing,Chengdu Technological University,Chengdu 611730,China)

机构地区：[1]成都工业学院智能制造学院,四川省电加工重点实验室,四川成都611730

出　　处：《电加工与模具》2025年第1期55-61,75,共8页Electromachining & Mould

基　　金：四川省科技计划项目(2023NSFSC0878);成都工业学院2024年校级本科教学成果培育项目(202404006S);成都工业学院2023年实验室开放基金项目(202314)。

摘　　要：光固化增材制造因光敏树脂材料成本高、调整参数过多导致打印质量不稳定。选取层厚、曝光时间、曝光强度和等待时间四个工艺参数作为单因素试验,结合试样表面粗糙度、力学拉伸性能指标进行分析,并采用L_(9)(3^(4))正交试验优化四个参数。结果表明:层厚对机械性能影响最大,曝光强度对表面质量影响最大,而等待时间对机械性能和表面质量影响均最小。基于极差分析,得出拉伸性能最佳成形参数组合A_(1)B_(1)C_(2)D_(2),表面质量最佳成形参数组合A_(2)B_(2)C_(2)D_(3),对光固化增材制造成形参数进行了有效优化。通过缺陷分析,5 500 ms曝光时间较低或1 400 mW/cm^(2)曝光强度过高是形成气孔的主要原因,而层厚大于0.05 mm或曝光强度低于1 350 mW/cm^(2)会增加裂纹倾向。The cost of using photosensitive resin materials for photocuring additive manufacturing is high,and too many adjustment parameters lead to unstable print quality.Four process parameters including layer thickness,exposure time,exposure intensity and waiting time were selected for single factor experiments,combined with the surface roughness and mechanical tensile properties of the samples,and then the orthogonal test of L_(9)(3^(4)) was used to optimize the four parameters.The results show that layer thickness has the greatest effect on mechanical properties,exposure intensity has the greatest effect on surface quality,and waiting time has the least effect on mechanical properties and surface quality.Based on the range analysis,the optimal combination of tensile properties A_(1)B_(1)C_(2)D_(2) and surface quality A_(2)B_(2)C_(2)D_(3) were obtained,which effectively optimized the photosensitive liquid phase curing additive molding process.According to the defect analysis,low exposure time or high exposure intensity are the main reasons for the formation of pores,while layer thickness greater than 0.05 mm or exposure intensity less than 1 350 mW/cm^(2) will increase the crack tendency.

关 键 词：光固化 正交试验 参数优化 

分 类 号：TG669[金属学及工艺—金属切削加工及机床]