组合添加剂对电解沉积超薄铜箔组织和力学性能的影响  

Effect of combined additives on microstructure and mechanical properties of electrodeposited ultra-thin copper foil

作　　者：林小燕 徐红彪 张嘉艺 尹鑫 王希米 李衔洋 谢长江 Lin Xiaoyan;Xu Hongbiao;Zhang Jiayi;Yin Xin;Wang Ximi;Li Xianyang;Xie Changjiang(School of Materials Science and Engineering,Jiangxi University of Technology,Ganzhou 341000,China;Jiangxi Tongbo Technology Co.,Ltd.,Fuzhou 344000,China)

机构地区：[1]江西理工大学材料科学与工程学院,江西赣州341000 [2]江西铜博科技股份有限公司,江西抚州344000

出　　处：《电镀与精饰》2025年第2期111-117,共7页Plating & Finishing

基　　金：校企合作项目(高性能5μm超薄铜箔产业化研究);国家级大学生创新创业项目(202310407016)。

摘　　要：为解决超薄铜箔的力学性能差的问题,采用了XRD、SEM、EBSD和万能试验机等方法,研究了聚二硫二丙烷磺酸钠(SPS)和胶原蛋白的组合添加及其浓度配比对铜箔的微观形貌与力学性能的影响。结果表明,添加5mg/LSPS及10mg/L胶原蛋白的铜箔呈现(111)择优取向,该配比下的铜箔表面最为平整,晶粒最细小,尺寸为0.3~4.3μm。添加5 mg/L SPS及10 mg/L胶原蛋白的铜箔比无添加的铜箔的抗拉强度高59 MPa。所以,SPS与胶原蛋白的协同作用使铜沉积地更均匀,从而获得更加平整的形貌和较小粗糙度值的铜箔。In order to solve the problem of poor mechanical properties of ultra-thin copper foil,the methods of XRD,SEM,EBSD and universal testing machine were used,and the effects of sodium polysulfide dipropane sulfonate(SPS)and collagen on the microstructure and mechanical properties of copper foil were studied.The results showed that the copper foil with 5 mg/L SPS and 10 mg/L collagen exhibited(111)preferred orientation,thus exhibiting the smoothest surface morphology of the copper foil with this ratio and the smallest grain size ranging from 0.3 to 4.3μm.The tensile strength of copper foil with 5 mg/L SPS and 10 mg/L collagen was 59 MPa,higher than that without SPS.Therefore,the synergistic effect of SPS and collagen made the deposition of copper more uniform,contributing to a flatter morphology and a lower roughness of copper foil.

关 键 词：SPS 胶原蛋白 超薄铜箔 晶粒 

分 类 号：TB31[一般工业技术—材料科学与工程] TG146.11[金属学及工艺—金属材料]