电解铜箔电解液中Cu^(2+)浓度控制过程能力分析  

Analysis of Process Capability for Controlling Cu^(2+)Concentration in Copper Foil Electrolyte

作　　者：童凯文 陈星 魏炯堂 付争兵 TONG Kaiwen;CHEN Xin;WEI Jiongtang;FU Zhengbing(Jiangxi Xinborui Technology Co.,Ltd.,Jiangxi Yingtan 335000,China)

机构地区：[1]江西鑫铂瑞科技股份有限公司,江西鹰潭335000

出　　处：《广州化工》2025年第3期163-165,182,共4页GuangZhou Chemical Industry

基　　金：江西省鹰潭市科带头人项目(20233-205952)。

摘　　要：Cu^(2+)浓度是铜箔生产工艺中的关键参数之一,其影响铜箔生产的产能实现及铜箔质量,因此控制其浓度具有重要意义。本文借助Minitab软件对生产实际电解液工艺参数进行统计,分析电解液制造过程中的Cpk和Ppk,发现问题并提出改进方向,为生产中合理地制定工艺标准以及实整控际调制提供依据,提高过程能力的同时,消除潜在对产品的质量隐患。The concentration of Cu^(2+)is a key parameter in the production process of electrolytic copper foil,which affects the production capacity and quality of copper foil.Therefore,it is significant for controlling the concentration of Cu^(2+).Minitab software was used to analyze the actual electrolyte parameter data in production,such as Cpk and Ppk in the electrolyte manufacturing process.This work was helpful for providing a basis for the reasonable formulation of process standards and actual adjustment and control in production,and eliminating potential quality hazards.

关 键 词：电解液 浓度控制 Minitab软件 

分 类 号：TQ151.5[化学工程—电化学工业]