基于有限元分析的笔记本纸浆模塑包装方案研究  

Molded Pulp Package for Laptop Computer Based on FEA

作　　者：张书炜 程旺 韦明堂 张倩 张湘钰 黄梦凯 ZHANG Shuwei;CHENG Wang;WEI Mingtang;ZHANG Qian;ZHANG Xiangyu;HUANG Mengkai(Hefei LCFC Information Technology Co.,Ltd.,Hefei 230071,China)

机构地区：[1]合肥联宝信息技术有限公司,合肥230071

出　　处：《包装工程》2025年第3期238-244,共7页Packaging Engineering

摘　　要：目的设计出一款低重量、高栈板量的笔记本电脑纸浆模塑(简称纸塑)包装方案,预估及验证新方案在跌落测试中对电脑的保护性。方法结合现有内翻和外翻纸塑方案各自结构的优势,设计出一种V型纸塑方案。基于跌落试验工况建立跌落仿真模型,通过ANSYS/LS-Dyna进行仿真分析,得到产品跌落加速度曲线和纸塑开裂变形图,并进行测试验证。结果V型方案在端面、顶面和短棱跌落的加速度均低于原内翻方案,各工况下V型方案无明显开裂,仿真分析与跌落测试结果高度一致。结论V型方案可在跌落测试中对电脑提供充分保护,满足落地条件,具有巨大的经济价值。有限元分析结果精度较高,可为各机型纸塑包装的开模定形提供依据,降低修模风险。The work aims to design a low-weight and high-pallet molded pulp package for laptop computer to estimate and verify the protection of the new scheme for the computer in the drop test.Combined with the advantages of the structures in the existing inward and outward package schemes,a V-shaped molded pulp scheme was designed.Based on the drop test conditions,a drop simulation model was established.Through ANSYS/LS-Dyna simulation analysis,the product drop acceleration curve and the molded pulp cracking stress diagrams were obtained.The V-shaped scheme had lower drop acceleration on the side face,top surface,and short edges compared to the original inward scheme.The V-shaped scheme had no cracking under various test conditions.The simulation results were highly consistent with the drop test results.The V-shaped scheme can provide full protection for the computer in the drop test,meet the landing conditions,and has great economic value.The results of finite element analysis have high accuracy,which can provide a basis for the opening and setting of molded pulp packaging of various models and reduce the risk of mold repair.

关 键 词：纸浆模塑 仿真分析 加速度 纸塑开裂 跌落试验 

分 类 号：TB485.3[一般工业技术—包装工程] TB482.2TB487