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作 者:孙仕祺 张景双[1] 铁瑛[1] 李成[1] 赵华东[1] Sun Shiqi;Zhang Jingshuang;Tie Ying;Li Cheng;Zhao Huadong(School of Mechanical&Power Engineering,Zhengzhou University,Zhengzhou 450001,China)
机构地区:[1]郑州大学机械与动力工程学院,郑州450001
出 处:《低温与超导》2024年第12期30-37,69,共9页Cryogenics and Superconductivity
基 金:河南省重点研发专项(231111210100)资助。
摘 要:为了将激光器芯片温度控制在最佳工作温度范围内,本文主要研究散热模组中热电制冷器(TEC)的内部结构,采用遗传算法和TOPSIS决策法对热电耦合方程中的制冷量和输出功率进行多目标优化,筛选出尺寸因子G和热电臂对数N。使用有限元仿真评估了二者以及间隙尺寸对整体散热性能的影响规律。结果表明:在可加工的范围内,增大G和N以及减小间隙尺寸可使其获得更好的制冷性能,为激光器的高效散热提供了理论和技术支持。To maintain the laser chip temperature within the optimal operating range,the internal structure of the thermoe⁃lectric cooler(TEC)within the heat dissipation module was designed and investigated.A combination of genetic algorithms and the TOPSIS decision-making method was applied for multi-objective optimization of the thermoelectric coupling equations,fo⁃cusing on cooling capacity and power consumption.The key factors identified were the size factor G and the number of thermoe⁃lectric legs N.Finite element simulations were conducted to evaluate the effects of these parameters,along with the gap size,on the overall heat dissipation performance.The results show that,within manufacturable limits,increasing G and N while reducing the gap size significantly improves TEC cooling performance,providing theoretical and technical support for efficient laser cool⁃ing.
关 键 词:热电制冷器 多目标优化 TOPSIS决策法 尺寸因子 热电臂对数 间隙尺寸
分 类 号:TB69[一般工业技术—制冷工程]
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